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参数资料
| 型号： | PCF8594C-2P/02,112 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 16/21页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM 4KBIT 100KHZ 8DIP |
| 标准包装： | 50 |
| 格式 - 存储器： | EEPROMs - 串行 |
| 存储器类型： | EEPROM |
| 存储容量： | 4K (512 x 8) |
| 速度： | 100kHz |
| 接口： | I²C，2 线串口 |
| 电源电压： | 2.5 V ~ 6.0 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 8-DIP |
| 包装： | 管件 |
| 其它名称： | 568-3639-5 935195510112 PCF8594C2N |
Philips Semiconductors
PCF8594C-2
512 × 8-bit CMOS EEPROM with I 2 C-bus interface
15. Soldering
15.1 Introduction
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering is often
preferred when through-hole and surface mount components are mixed on one
printed-circuit board. Wave soldering can still be used for certain surface mount ICs,
but it is not suitable for ?ne pitch SMDs. In these situations re?ow soldering is
recommended. Driven by legislation and environmental forces the worldwide use of
lead-free solder pastes is increasing.
15.2 Through-hole mount packages
15.2.1
15.2.2
Soldering by dipping or by solder wave
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 ° C or
265 ° C, depending on solder material applied, SnPb or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the speci?ed maximum storage temperature (T stg(max) ).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300 ° C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 ° C, contact may be up to 5 seconds.
15.3 Surface mount packages
9397 750 14221
15.3.1
Re?ow soldering
Re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for re?owing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical re?ow peak temperatures range from 215 to 270 ° C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
? below 225 ° C (SnPb process) or below 245 ° C (Pb-free process)
– for all the BGA and SSOP-T packages
? Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 05 — 25 October 2004
16 of 21
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PCF8594C-2T | 制造商:NXP Semiconductors 功能描述:Bulk |
| PCF8594C-2T/02,112 | 功能描述:电可擦除可编程只读存储器 512X8 电可擦除可编程只读存储器 RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 |
| PCF8594C-2T/02,118 | 功能描述:电可擦除可编程只读存储器 512X8 电可擦除可编程只读存储器 2.5V TO 6.0V RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 |
| PCF8594C-2T/02112 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| PCF8594C-2T02 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:512 X 8-bit CMOS EEPROM with I2C-bus interface |
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