参数资料
型号: PCS3P25811AG08SR
厂商: ON Semiconductor
文件页数: 7/9页
文件大小: 0K
描述: IC CLOCK GEN 4-32MHZ 8-SOIC
标准包装: 1
类型: *
PLL:
输入: LVCMOS,晶体
输出: LVCMOS
电路数: 1
比率 - 输入:输出: 1:1
差分 - 输入:输出: 无/无
频率 - 最大: 32MHz
除法器/乘法器: 是/无
电源电压: 2.8 V ~ 3.6 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 标准包装
其它名称: PCS3P25811AG08SROSDKR
PCS3P25811, PCS3P25812, PCS3P25814
http://onsemi.com
7
PACKAGE DIMENSIONS
SOIC8NB EP
CASE 751BU
ISSUE B
SEATING
PLANE
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.10mm IN EXCESS OF MAXIMUM MATERIAL
CONDITION.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH,
PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15mm PER SIDE. DIMENSION E DOES
NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25mm PER
SIDE. DIMENSIONS D AND E ARE DETERMINED AT
DATUM F.
5. DIMENSIONS A AND B ARE TO BE DETERMINED
AT DATUM F.
6. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
7. TAB CONTOUR MAY VARY MINIMALLY TO INCLUDE
TOOLING FEATURES.
A
DIM
MIN
MAX
MILLIMETERS
G
1.55
3.07
A
1.35
1.75
b
0.31
0.51
e
1.27 BSC
A1
0.10
b1
0.28
0.48
h
0.25
0.50
C
M
0.25
DIMENSION: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
L2
0.25 BSC
A
TOP VIEW
C
0.20
A-B D
C
0.10
NOTE 5
C
0.10
b
8X
B
C
8X
SIDE VIEW
END VIEW
DETAIL A
7.00
8X
1.52
8X
0.60
1.27
PITCH
RECOMMENDED
1
L
F
SEATING
PLANE
DETAIL A
D
L2
A1
C
NOTE 6
1
4
5
8
C
0.10
A-B
NOTE 5
e
NOTE 7
F
G
BOTTOM VIEW
3.30
3.10
c
0.17
0.25
L
0.40
1.27
2X
NOTE 4
2X 4 TIPS
C
0.10
2X
NOTE 4
h
c1
0.17
0.23
F
1.55
3.07
D
4.90 BSC
E
6.00 BSC
E1
3.90 BSC
E
E1
D
D
B
SECTION BB
c c1
b
b1
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