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| 型号： | PE42750MLAB-Z |
| 厂商： | Peregrine Semiconductor |
| 文件页数： | 10/12页 |
| 文件大小： | 0K |
| 描述： | IC RF SWITCH SPDT 75 OHM 12QFN |
| 标准包装： | 1 |
| 系列： | UltraCMOS™ |
| RF 型： | CATV |
| 频率： | 5MHz ~ 2.2GHz |
| 特点： | SPDT |
| 封装/外壳： | 12-WFQFN 裸露焊盘 |
| 供应商设备封装： | 12-QFN（3x3） |
| 包装： | 标准包装 |
| 其它名称： | 1046-1041-6 |
Simply Designed. Simply Green . Only UltraCMOS . ?
For years, IC and process designers have
been interested in UltraCMOS? Silicon-
on-Sapphire (SOS) technology as a high-
performance alternative to high-voltage
RF processes such as SiGe and GaAs.
Today, engineers around the world benefit from
not only the performance advantages, but also the
fundamental properties of UltraCMOS which make it
an environmentally friendly option.
Leave a Smaller Footprint…And Less eWaste
Adding to the potential environmental
advantages, UltraCMOS technology enables high
levels of monolithic integration, resulting in smaller
die and fewer external components in the design.
Go Green…Not Toxic
As semiconductor processing materials and eWaste
are scrutinized by governments and industries around
the globe, growing concern over the toxicity and
carcinogenic nature of GaAs, along with its associated
arsenic slurries, continues to drive market leaders
toward more eco-friendly technology solutions.
Low Power Consumption
Low parasitic advantages of standard Silicon-on-
Insulator (SOI) are strengthened with the UltraCMOS
process, which delivers minimum parasitic capacitance
and industry leading dispersion. When compared to
the high-voltage RF processes, UltraCMOS devices
consume less power.
Going Green Starts on the Inside
The UltraCMOS process, a high-performance variation of SOI process, is not based on arsenic
(as are all GaAs-based devices) but instead incorporates a sapphire substrate, which intrinsically
Wire-bondDie offers both environmental as well as RF benefits. See Peregrine’s Green Package Information
and Flip Chip sheet and Certificate of Conformance on psemi.com to learn more.
RoHS-Compliant Commercial Packaging Options
Peregrine is proud to offer RoHS-compliant, lead-
free (Pb-free) packaging for its UltraCMOS RFICs.
Pb-free packages utilize matte tin (Sn) plating, or for
select QFN packages NiPdAu plating, on to copper
lead frames. The reliability aspects of matte Sn plating
have been well-researched, including solderability
with both Pb-free and standard SnPb solders, and
whisker growth in accelerated termperature/humidity
conditions. NiPdAu plating provides a solderable
surface for both eutectic and Pb-free solders, is less
susceptible to oxidation, and provides long-term
storage and solderability.
As regulatory conditions change and new Pb-free
packaging solutions become available, Peregrine will
maintain its commitment to doing its part to preserve
our environment. If the Pb-free solution that you
require is not shown, please consult with Peregrine or
any of its worldwide sales representatives for solutions
to your specific need.
6L SC70
8L 1.5x1.5 DFN 10L 2x2 QFN
12L 2x2 QFN
8L MSOP
6L DFN
12L 3x3 QFN
1.3 x 2.0 x 1.0
1.5 x 1.5x 0.50
2.0 x 2.0 x 0.45
2.0 x 2.0 x 0.60
3.0 x 3.0 x 1.1
3.0 x 3.0 x 0.9
3.0 x 3.0 x 0.75
Regular and exposed
ground paddle
Fused and Isolated
versions
16L 3x3 QFN
3.0 x 3.0 x 0.75
20L 4x4 LGA
4.0 x 4.0 x 0.9
20L 4x4 QFN
4.0 x 4.0 x 0.9
24L 4x4 QFN
4.0 x 4.0 x 0.9
32L 5x5 QFN
5.0 x 5.0 x 0.9
32L 5x5 LGA
5.0 x 5.0 x 0.9
48L QFN
7.0 x 7.0 x 0.9
All dimensions are listed in millimeters (width x length x height) and are approximate.
See product datasheets for exact dimensions.
10
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