参数资料
型号: PESD3V3S1UB,115
厂商: NXP Semiconductors
文件页数: 10/15页
文件大小: 0K
描述: DIODE ESD PROTECTION SOD523
产品培训模块: ESD Protection Diodes
ESD Standards and Products
标准包装: 1
电压 - 反向隔离(标准值): 3.3V
电压 - 击穿: 5.2V
功率(瓦特): 330W
电极标记: 单向
安装类型: 表面贴装
封装/外壳: SC-79,SOD-523
供应商设备封装: SOD-523
包装: 标准包装
产品目录页面: 1511 (CN2011-ZH PDF)
其它名称: 568-4044-6
NXP Semiconductors
PESDxS1UB series
ESD protection diodes in SOD523 package
7. Application information
The PESDxS1UB series is designed for unidirectional protection of one single data line
from the damage caused by ESD (ElectroStatic Discharge) and Surge Pulses. The
PESDxS1UB series may be used on lines where the signal polarity is above or below
ground. The PESDxS1UB series provides a surge capability of up to 330 Watts per line for
a 8/20 μ s waveform.
line to be protected
(positive signal polarity)
PESDxS1UB
ground
line to be protected
(negative signal polarity)
PESDxS1UB
ground
uni-directional protection of one line
006aaa002
Fig 9.
Unidirectional protection of one line
Circuit board layout and protection device placement:
Circuit board layout is critical for the suppression of ESD, EFT and Surge transients.
The following guidelines are recommended:
1. Place the protection device as close to the input terminal or connector as possible.
2. The path length between the protection device and the protected line should be
minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protection conductors in parallel with unprotected conductor.
5. Minimize all printed-circuit board conductive loops including power and ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer printed-circuit
boards, use ground vias.
PESDXS1UB_SERIES_2
? NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 24 August 2009
10 of 15
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