参数资料
型号: PFS757HG
厂商: POWER INTEGRATIONS INC
元件分类: 稳压器
英文描述: 1.82 A SWITCHING CONTROLLER, 70 kHz SWITCHING FREQ-MAX, PZIP16
封装: HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SIP-16
文件页数: 5/36页
文件大小: 4692K
代理商: PFS757HG
Rev. C 02/11
13
TFS757-764HG
www.powerint.com
Output Power Table
Product2
Two-Switched Forward
380 V
Flyback
100 V - 400 V
Continuous1
(25 °C)
Continuous1
(50 °C)
Peak
(50 °C)
50 °C
TFS757HG
193 W
163 W
228 W
20 W
TFS758HG
236 W
200 W
278 W
20 W
TFS759HG
280 W
235 W
309 W
20 W
TFS760HG
305 W
258 W
358 W
20 W
TFS761HG
326 W
276 W
383 W
20 W
TFS762HG
360 W
304 W
407 W
20 W
TFS763HG
388 W
327 W
455 W
20 W
TFS764HG
414 W
344 W
530 W
20 W
Table 5. Output Power Table.
Notes:
1. Maximum practical continuous power in an open frame design with adequate
heat sinking (assuming heat sink θ
C-A of <4 °C/W), measured at specified
ambient temperature (see Key Applications Considerations for more information).
2. Package: eSIP16/12. (Note: Direct attach to heat sink, does not require
insulation SIL pad)
2. Second a 15 mA threshold (I
BP(SD))for standby secondary OVP
latch-off. When the BYPASS pin current exceeds this
threshold, the standby and main converters are latched-off.
This latch can be reset by pulling the LINE-SENSE pin below
the line undervoltage threshold (I
L(SB-UVOFF)), or by discharging
the BYPASS pin below 4.7 V.
Note: unlike the TinySwitch-III the HiperTFS BYPASS pin capacitor
does not provide any programming capability. Instead the
recommended BYPASS pin capacitor should always be a 1 mF
(ceramic) capacitor.
Main and Standby Line Overvoltage Detection (OV)
The overvoltage threshold is included in the device, and can be
used to disable the device during overvoltage (with the use of
an additional external signal Zener). The overvoltage threshold
is set sufficiently high to prevent accidental triggering during
boost PFC overshoot conditions. When the overvoltage
condition is triggered, it will simultaneously shutdown both the
Main and Standby. The overvoltage feature is intended for use
with external components (circuitry), to program the overvoltage
threshold independently of the undervoltage thresholds (see the
Applications section for details).
High-Power eSIP Package
The HiperTFS package is designed to minimize the physical size
of the device, while maintaining a low thermal impedance and
sufficient electrical spacing for the pins. The package has 12
functional pins with 4 pins removed for increased pin-to-pin
spacing between high-voltage pins. The low-side two-switch
forward and flyback MOSFETs have a thermal impedance of
less than 1 °C/W to the exposed pad on the back of the
package. Since this pad is referenced to the SOURCE pin
(Source), it is at electrical ground potential and thus can be
connected to the heat sink without need for electrical insulation.
The high-side MOSFET is over-molded to achieve electrical
isolation and thus also allows direct connection to the heat sink.
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