参数资料
型号: PIC12CE673-10E/P
厂商: Microchip Technology
文件页数: 124/129页
文件大小: 0K
描述: IC MCU OTP 1KX14 A/D&EE 8DIP
产品培训模块: Asynchronous Stimulus
标准包装: 60
系列: PIC® 12C
核心处理器: PIC
芯体尺寸: 8-位
速度: 10MHz
外围设备: POR,WDT
输入/输出数: 5
程序存储器容量: 1.75KB(1K x 14)
程序存储器类型: OTP
EEPROM 大小: 16 x 8
RAM 容量: 128 x 8
电压 - 电源 (Vcc/Vdd): 3 V ~ 5.5 V
数据转换器: A/D 4x8b
振荡器型: 内部
工作温度: -40°C ~ 125°C
封装/外壳: 8-DIP(0.300",7.62mm)
包装: 管件
PIC12C67X
DS30561B-page 94
1999 Microchip Technology Inc.
12.2
DC Characteristics:
PIC12LC671/672 (Commercial, Industrial)
PIC12LCE673/674 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise specified)
Operating temperature
0°C
≤ TA ≤ +70°C (commercial)
–40°C
≤ TA ≤ +85°C (industrial)
Param
No.
Characteristic
Sym
Min
Typ Max Units
Conditions
D001
Supply Voltage
VDD
2.5
5.5
V
D002
RAM Data Retention
Voltage(2)
VDR
1.5*
V
Device in SLEEP mode
D003
VDD Start Voltage to
ensure Power-on Reset
VPOR
VSS
V
See section on Power-on Reset for details
D004
VDD Rise Rate to ensure
Power-on Reset
SVDD
0.05*
V/ms See section on Power-on Reset for details
D010
D010C
D010A
Supply Current(3)
IDD
0.4
15
2.1
33
mA
A
FOSC = 4MHz, VDD = 2.5V
XT and EXTRC mode (Note 4)
FOSC = 4MHz, VDD = 2.5V
INTRC mode (Note 6)
FOSC = 32kHz, VDD = 2.5V, WDT disabled
LP mode, Industrial Temperature
D020
D021
D021B
Power-down Current(5)
IPD
0.2
5
6
A
VDD = 2.5V, Commercial
VDD = 2.5V, Industrial
Watchdog Timer Current
IWDT
—2.0
2.0
4
6
A
VDD = 2.5V, Commercial
VDD = 2.5V, Industrial
LP Oscillator Operating
Frequency
INTRC/EXTRC Oscillator
Operating Frequency
XT Oscillator Operating
Frequency
HS Oscillator Operating
Frequency
FOSC
0
0
200
4(6)
4
10
kHz
MHz
All temperatures
*
These parameters are characterized but not tested.
Note 1:
Data in Typical ("Typ") column is based on characterization results at 25°C. This data is for design guidance only and is not
tested.
2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator
type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption.
a) The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD,
MCLR = VDD; WDT disabled.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode.
4: For EXTRC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the
formula:
Ir = VDD/2REXT (mA) with REXT in kOhm.
5: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the
part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
6: INTRC calibration value is for 4MHz nominal at 5V, 25°C.
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