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参数资料
型号： PIC16F526-E/P
厂商： Microchip Technology
文件页数： 42/122页
文件大小： 0K
描述： IC PIC MCU FLASH 1KX12 14DIP
产品培训模块： 8-bit PIC® Microcontroller Portfolio
标准包装： 30
系列： PIC® 16F
核心处理器： PIC
芯体尺寸： 8-位
速度： 20MHz
外围设备： POR，WDT
输入/输出数： 11
程序存储器容量： 1.5KB（1K x 12）
程序存储器类型： 闪存
RAM 容量： 67 x 8
电压 - 电源 (Vcc/Vdd)： 2 V ~ 5.5 V
数据转换器： A/D 3x8b
振荡器型： 内部
工作温度： -40°C ~ 125°C
封装/外壳： 14-DIP（0.300"，7.62mm）
包装： 管件
产品目录页面： 638 (CN2011-ZH PDF)
配用： AC162096-ND - HEADER MPLAB ICD2 PIC16F526 8/14
PIC18F2221/2321/4221/4321 FAMILY
DS39689F-page 26
2009 Microchip Technology Inc.
2.2
Power Supply Pins
2.2.1
DECOUPLING CAPACITORS
The use of decoupling capacitors on every pair of
power supply pins, such as VDD, VSS, AVDD and
AVSS, is required.
Consider the following criteria when using decoupling
capacitors:
Value and type of capacitor: A 0.1
μF (100 nF),
10-20V capacitor is recommended. The capacitor
should be a low-ESR device with a resonance
frequency in the range of 200 MHz and higher.
Ceramic capacitors are recommended.
Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is no greater
than 0.25 inch (6 mm).
Handling high-frequency noise: If the board is
experiencing high-frequency noise (upward of
tens of MHz), add a second ceramic type capaci-
tor in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01
μF to 0.001 μF. Place this
second capacitor next to each primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible
(e.g., 0.1
μF in parallel with 0.001 μF).
Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to
a minimum, thereby reducing PCB trace
inductance.
2.2.2
TANK CAPACITORS
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including microcontrollers to
supply a local power source. The value of the tank
capacitor should be determined based on the trace
resistance that connects the power supply source to
the device and the maximum current drawn by the
device in the application. In other words, select the tank
capacitor so that it meets the acceptable voltage sag at
the device. Typical values range from 4.7
μF to 47 μF.
2.3
Master Clear (MCLR) Pin
The MCLR pin provides two specific device
functions: device Reset, and device programming
and debugging. If programming and debugging are
not required in the end application, a direct
connection to VDD may be all that is required. The
addition of other components, to help increase the
application’s resistance to spurious Resets from
voltage
sags,
may
be
beneficial.
A
typical
configuration is shown in Figure 2-1. Other circuit
designs may be implemented depending on the
application’s requirements.
During programming and debugging, the resistance
and capacitance that can be added to the pin must
be considered. Device programmers and debuggers
drive the MCLR pin. Consequently, specific voltage
levels (VIH and VIL) and fast signal transitions must
not be adversely affected. Therefore, specific values
of R1 and C1 will need to be adjusted based on the
application and PCB requirements. For example, it is
recommended that the capacitor, C1, be isolated
from the MCLR pin during programming and
debugging operations by using a jumper (Figure 2-2).
The
jumper
is
replaced
for
normal
run-time
operations.
Any components associated with the MCLR pin
should be placed within 0.25 inch (6 mm) of the pin.
FIGURE 2-2:
EXAMPLE OF MCLR PIN
CONNECTIONS
Note 1: R1
≤ 10 kΩ is recommended. A suggested
starting value is 10 k
Ω. Ensure that the
MCLR pin VIH and VIL specifications are met.
2: R2
≤ 470Ω will limit any current flowing into
MCLR from the external capacitor, C, in the
event of MCLR pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
VIH and VIL specifications are met.
C1
R2
R1
VDD
MCLR
PIC18FXXXX
JP
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PIC16F526-I/MG 功能描述:8位微控制器 -MCU 1.5KB Flash Program 8MHz Int Osc RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F526-I/P 功能描述:8位微控制器 -MCU 15KB 64B 8MHz 8B ADC Internal Oscillator RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F526-I/SL 功能描述:8位微控制器 -MCU 15KB 64B 8MHz 8B ADC Internal Oscillator RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F526-I/SLC04 制造商:Microchip Technology Inc 功能描述:
PIC16F526-I/ST 功能描述:8位微控制器 -MCU 15KB 64B 8MHz 8B ADC Internal Oscillator RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
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