参数资料
型号: PIC16F688T-I/SL
厂商: Microchip Technology
文件页数: 32/204页
文件大小: 0K
描述: IC MCU PIC FLASH 4KX14 14SOIC
产品培训模块: Asynchronous Stimulus
8-bit PIC® Microcontroller Portfolio
标准包装: 2,600
系列: PIC® 16F
核心处理器: PIC
芯体尺寸: 8-位
速度: 20MHz
连通性: UART/USART
外围设备: 欠压检测/复位,POR,WDT
输入/输出数: 12
程序存储器容量: 7KB(4K x 14)
程序存储器类型: 闪存
EEPROM 大小: 256 x 8
RAM 容量: 256 x 8
电压 - 电源 (Vcc/Vdd): 2 V ~ 5.5 V
数据转换器: A/D 8x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 14-SOIC(0.154",3.90mm 宽)
包装: 带卷 (TR)
产品目录页面: 639 (CN2011-ZH PDF)
配用: XLT14SO-1-ND - SOCKET TRANSITION 14SOIC 150/208
AC162061-ND - HEADER INTRFC MPLAB ICD2 20PIN
AC162056-ND - HEADER INTERFACE ICD2 16F688
其它名称: PIC16F688T-I/SL-ND
PIC16F688T-I/SLTR
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2009 Microchip Technology Inc.
DS41203E-page 125
PIC16F688
11.6
Power-Down Mode (Sleep)
The Power-down mode is entered by executing a
SLEEP
instruction.
If the Watchdog Timer is enabled:
WDT will be cleared but keeps running.
PD bit in the Status register is cleared.
TO bit is set.
Oscillator driver is turned off.
I/O ports maintain the status they had before SLEEP
was executed (driving high, low or high-impedance).
For lowest current consumption in this mode, all I/O
pins should be either at VDD or VSS, with no external
circuitry drawing current from the I/O pin, and the
comparators and CVREF should be disabled. I/O pins
that are high-impedance inputs should be pulled high
or low externally to avoid switching currents caused by
floating inputs. The T0CKI input should also be at VDD
or
VSS
for
lowest
current
consumption.
The
contribution from on-chip pull-ups on PORTA should be
considered.
The MCLR pin must be at a logic high level.
11.6.1
WAKE-UP FROM SLEEP
The device can wake-up from Sleep through one of the
following events:
1.
External Reset input on MCLR pin.
2.
Watchdog
Timer
wake-up
(if
WDT
was
enabled).
3.
Interrupt from RA2/INT pin, PORTA change or a
peripheral interrupt.
The first event will cause a device Reset. The two latter
events are considered a continuation of program
execution. The TO and PD bits in the Status register
can be used to determine the cause of device Reset.
The PD bit, which is set on power-up, is cleared when
Sleep is invoked. TO bit is cleared if WDT wake-up
occurred.
The following peripheral interrupts can wake the device
from Sleep:
1.
Timer1 interrupt. Timer1 must be operating as
an asynchronous counter.
2.
A/D conversion (when A/D clock source is FRC).
3.
EEPROM write operation completion.
4.
Comparator output changes state.
5.
Interrupt-on-change.
6.
External Interrupt from INT pin.
7.
EUSART Receive Interrupt.
8.
ULPWU Interrupt.
Other peripherals cannot generate interrupts since
during Sleep, no on-chip clocks are present.
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is prefetched. For the device to
wake-up through an interrupt event, the corresponding
interrupt enable bit must be set (enabled). Wake-up is
regardless of the state of the GIE bit. If the GIE bit is
clear (disabled), the device continues execution at the
instruction after the SLEEP instruction. If the GIE bit is
set (enabled), the device executes the instruction after
the SLEEP instruction, then branches to the interrupt
address (0004h). In cases where the execution of the
instruction following SLEEP is not desirable, the user
should have a NOP after the SLEEP instruction.
The WDT is cleared when the device wakes up from
Sleep, regardless of the source of wake-up.
11.6.2
WAKE-UP USING INTERRUPTS
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the following will occur:
If the interrupt occurs before the execution of a
SLEEP
instruction, the SLEEP instruction will
complete as a NOP. Therefore, the WDT and WDT
prescaler and postscaler (if enabled) will not be
cleared, the TO bit will not be set and the PD bit
will not be cleared.
If the interrupt occurs during or after the
execution of a SLEEP instruction, the device will
immediately wake-up from Sleep. The SLEEP
instruction will be completely executed before the
wake-up. Therefore, the WDT and WDT prescaler
and postscaler (if enabled) will be cleared, the TO
bit will be set and the PD bit will be cleared.
Even if the flag bits were checked before executing a
SLEEP
instruction, it may be possible for flag bits to
become set before the SLEEP instruction completes.
To determine whether a SLEEP instruction executed,
test the PD bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP.
To ensure that the WDT is cleared, a CLRWDT instruction
should be executed before a SLEEP instruction.
Note:
It should be noted that a Reset generated
by a WDT time-out does not drive MCLR
pin low.
Note:
If the global interrupts are disabled (GIE is
cleared), but any interrupt source has both
its interrupt enable bit and the correspond-
ing interrupt flag bits set, the device will
immediately wake-up from Sleep. The
SLEEP
instruction is completely executed.
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PIC16F689-E/ML 功能描述:8位微控制器 -MCU 7.1 KB 256 RAM 18I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F689-E/P 功能描述:8位微控制器 -MCU 7KB 256 RAM 12 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F689-E/SO 功能描述:8位微控制器 -MCU 7KB FL 256R 18 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F689-E/SS 功能描述:8位微控制器 -MCU 7KB FL 256R 18 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC16F689-I/ML 功能描述:8位微控制器 -MCU 7.1 KB 256 RAM 18I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT