参数资料
型号: PIC18F86J11-I/PT
厂商: Microchip Technology
文件页数: 101/107页
文件大小: 0K
描述: IC PIC MCU FLASH 32KX16 80TQFP
产品培训模块: Asynchronous Stimulus
PIC18 J Series MCU Overview
8-bit PIC® Microcontroller Portfolio
标准包装: 119
系列: PIC® 18F
核心处理器: PIC
芯体尺寸: 8-位
速度: 48MHz
连通性: EBI/EMI,I²C,SPI,UART/USART
外围设备: 欠压检测/复位,LVD,POR,PWM,WDT
输入/输出数: 68
程序存储器容量: 64KB(32K x 16)
程序存储器类型: 闪存
RAM 容量: 3930 x 8
电压 - 电源 (Vcc/Vdd): 2 V ~ 3.6 V
数据转换器: A/D 15x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 80-TQFP
包装: 托盘
产品目录页面: 644 (CN2011-ZH PDF)
配用: AC162091-ND - HEADER MPLAB ICD2 18F87J11 64/80
MA180020-ND - MODULE PLUG-IN HPC EXPL 18F87J11
AC164328-ND - MODULE SKT FOR 80TQFP
2007-2012 Microchip Technology Inc.
DS39778E-page 93
PIC18F87J11 FAMILY
6.6.3
MAPPING THE ACCESS BANK IN
INDEXED LITERAL OFFSET MODE
The use of Indexed Literal Offset Addressing mode
effectively changes how the lower part of Access RAM
(00h to 5Fh) is mapped. Rather than containing just the
contents of the bottom part of Bank 0, this mode maps
the contents from Bank 0 and a user-defined “window”
that can be located anywhere in the data memory
space. The value of FSR2 establishes the lower bound-
ary of the addresses mapped into the window, while the
upper boundary is defined by FSR2 plus 95 (5Fh).
Addresses in the Access RAM above 5Fh are mapped
as previously described (see Section 6.3.2 “Access
). An example of Access Bank remapping in this
addressing mode is shown in Figure 6-11.
Remapping of the Access Bank applies only to opera-
tions using the Indexed Literal Offset mode. Operations
that use the BSR (Access RAM bit is ‘1’) will continue
to use Direct Addressing as before. Any Indirect or
Indexed Addressing operation that explicitly uses any
of the indirect file operands (including FSR2) will con-
tinue to operate as standard Indirect Addressing. Any
instruction that uses the Access Bank, but includes a
register address of greater than 05Fh, will use Direct
Addressing and the normal Access Bank map.
6.6.4
BSR IN INDEXED LITERAL
OFFSET MODE
Although the Access Bank is remapped when the
extended instruction set is enabled, the operation of the
BSR remains unchanged. Direct Addressing, using the
BSR to select the data memory bank, operates in the
same manner as previously described.
FIGURE 6-11:
REMAPPING THE ACCESS BANK WITH INDEXED LITERAL
OFFSET ADDRESSING
Data Memory
000h
100h
200h
F60h
F00h
FFFh
Bank 1
Bank 15
Bank 2
through
Bank 14
SFRs
05Fh
ADDWF f, d, a
FSR2H:FSR2L = 120h
Locations in the region
from the FSR2 Pointer
(120h) to the pointer plus
05Fh (17Fh) are mapped
to the bottom of the
Access RAM (000h-05Fh).
Special Function Registers
at F60h through FFFh are
mapped to 60h through
FFh, as usual.
Bank 0 addresses below
5Fh are not available in
this mode. They can still
be addressed by using the
BSR.
Access Bank
00h
FFh
Bank 0
SFRs
Bank 1 “Window”
Not Accessible
Window
Example Situation:
120h
17Fh
5Fh
60h
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PIC18F86J11T-I/PT 功能描述:8位微控制器 -MCU 64KB Flash 3936bytes RAM 67 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F86J15-I/PT 功能描述:8位微控制器 -MCU 96 KB FL 4 KB RAM RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F86J15T-I/PT 功能描述:8位微控制器 -MCU 96 KB FL 4 KB RAM RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F86J16-I/PT 功能描述:8位微控制器 -MCU 96KB FL 3936b RAM 10 MIPS 67 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F86J16T-I/PT 功能描述:8位微控制器 -MCU 96KB Flash 3936bytes RAM 67 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT