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参数资料
| 型号： | PIM200AZ |
| 厂商： | LINEAGE POWER LLC |
| 元件分类： | 电源模块 |
| 英文描述： | 1-OUTPUT 8 W DC-DC REG PWR SUPPLY MODULE |
| 封装： | ROHS COMPLIANT PACKAGE-13 |
| 文件页数： | 6/18页 |
| 文件大小： | 346K |
| 代理商： | PIM200AZ |
Data Sheet
October 5, 2009
PIM200X Series; ATCA Board Power Input Modules
-38 to -75Vdc; 200W Input
LINEAGE POWER
14
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel. The test set-
up is shown in Figure 14.
Figure 15. Thermal Test Set-up
Note that the airflow is parallel to the long axis of the
module as shown in Figure 15. The derating data
applies to airflow in either direction of the module’s
long axis.
Figure 16. Tref Temperature measurement location
The thermal reference point, Tref used in the
specifications is shown in Figure 16. For reliable
operation this temperature should not exceed 115
oC.
The output power of the module should not exceed
the rated input power of the module i.e. 200W.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Thermal derating curves
showing the maximum output current that can be
delivered by the module versus local ambient
temperature (TA) for natural convection and up to
2m/s (400 ft./min) are shown in the Characteristics
Curves (Figs 11 & 12).
Manufacturing Considerations
Lead Free Soldering Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3
°C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210
°C. For Pb solder, the recommended pot
temperature is 260
°C, while the Pb-free solder pot is
270
°C max. If additional information is needed, please
consult with your Lineage Power representative for
more details.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power’s Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AP01-056EPS)
Tref
A ir
flo w
x
Po w e r M o d u le
W in d Tu n n e l
PW Bs
5.97 _
(0 .2 35)
76 .2 _
(3 .0 )
Pro b e Lo c a t io n
fo r m e a su rin g
airflo w a n d
am b ie n t
te m p e ra t u re
25.4 _
(1.0 )
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