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| 型号： | PK40X256VMD100 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 24/78页 |
| 文件大小： | 0K |
| 描述： | IC ARM CORTEX MCU 256K 144-MAP |
| 产品培训模块： | Kinetis® Cortex-M4 Microcontroller Family |
| 标准包装： | 1 |
| 系列： | Kinetis |
| 核心处理器： | ARM? Cortex?-M4 |
| 芯体尺寸： | 32-位 |
| 速度： | 100MHz |
| 连通性： | CAN，EBI/EMI，I²C，IrDA，SDHC，SPI，UART/USART，USB，USB OTG |
| 外围设备： | DMA，I²S，LCD，LVD，POR，PWM，WDT |
| 输入/输出数： | 98 |
| 程序存储器容量： | 256KB（256K x 8） |
| 程序存储器类型： | 闪存 |
| EEPROM 大小： | 4K x 8 |
| RAM 容量： | 64K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 1.71 V ~ 3.6 V |
| 数据转换器： | A/D 33x16b，D/A 2x12b |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 105°C |
| 封装/外壳： | 144-LBGA |
| 包装： | 托盘 |
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1. This parameter is measured with the internal reference (slow clock) being used as a reference to the FLL (FEI clock
mode).
2. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32=0.
3. The resulting system clock frequencies should not exceed their maximum specified values. The DCO frequency deviation
(
Δfdco_t) over voltage and temperature should be considered.
4. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32=1.
5. The resulting clock frequency must not exceed the maximum specified clock frequency of the device.
6. This specification applies to any time the FLL reference source or reference divider is changed, trim value is changed,
DMX32 bit is changed, DRS bits are changed, or changing from FLL disabled (BLPE, BLPI) to FLL enabled (FEI, FEE,
FBE, FBI). If a crystal/resonator is being used as the reference, this specification assumes it is already running.
7. Excludes any oscillator currents that are also consuming power while PLL is in operation.
8. This specification was obtained using a Freescale developed PCB. PLL jitter is dependent on the noise characteristics of
each PCB and results will vary.
9. This specification applies to any time the PLL VCO divider or reference divider is changed, or changing from PLL disabled
(BLPE, BLPI) to PLL enabled (PBE, PEE). If a crystal/resonator is being used as the reference, this specification assumes
it is already running.
6.3.2 Oscillator electrical specifications
This section provides the electrical characteristics of the module.
6.3.2.1 Oscillator DC electrical specifications
Table 16. Oscillator DC electrical specifications
Symbol
Description
Min.
Typ.
Max.
Unit
Notes
VDD
Supply voltage
1.71
—
3.6
V
IDDOSC
Supply current — low-power mode (HGO=0)
32 kHz
4 MHz
8 MHz (RANGE=01)
16 MHz
24 MHz
32 MHz
—
500
200
300
950
1.2
1.5
—
nA
μA
mA
IDDOSC
Supply current — high gain mode (HGO=1)
32 kHz
4 MHz
8 MHz (RANGE=01)
16 MHz
24 MHz
32 MHz
—
25
400
500
2.5
3
4
—
μA
mA
Cx
EXTAL load capacitance
—
Cy
XTAL load capacitance
—
Table continues on the next page...
Peripheral operating requirements and behaviors
K40 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013.
30
Freescale Semiconductor, Inc.
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