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Ericsson Internal
PRODUCT SPECIFICATION
2 (5)
Prepared (also subject responsible if other)
No.
MICUPEZ
4/1301-BMR 622 Uen
Approved
Checked
Date
Rev
Reference
M. Anderzen
See § 1
2006-03-14
B
Soldering Information - Surface mounting
The product is intended for convection or vapor phase reflow
SnPb [and/or] Pb-free processes. To achieve a good and
reliable soldering result, make sure to follow the
recommendations from the solder paste supplier, to use
state-of-the-art reflow equipment and reflow profiling
techniques as well as the following guidelines.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product. The cleaning
residues may affect long time reliability and isolation voltage.
A sufficiently extended preheat time is recommended to
ensure an even temperature across the host PCB, for both
small and large devices. To reduce the risk of excessive
heating is also recommended to reduce the time in the reflow
zone as much as possible.
Minimum pin temperature recommendations
Pin number 22 is chosen as reference location for the
minimum pin temperature recommendations.
SnPb solder processes
For Pb solder processes, a pin temperature (T
PIN) in excess of
the solder melting temperature, (T
L, +183°C for Sn63/Pb37)
for more than 30 seconds, and a peak temperature of +210°C
is recommended to ensure a reliable solder joint.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
PIN) in
excess of the solder melting temperature (T
L, +217 to +221 °C
for Sn/Ag/Cu solder alloys) for more than 30 seconds, and a
peak temperature of +235°C on all solder joints is
recommended to ensure a reliable solder joint.
SnPb solder processes
For conventional SnPb solder processes, the product is
qualified for MSL 1 according to IPC/JEDEC standard
J-STD-020C.
During reflow, T
Pin must not exceed +235 °C at any time.
Min 10 s over 200 °C
30-100 s over 183 °C
Lead-free (Pb-free) solder processes- TBD AFTER REVIEW
For Pb-free solder processes, the product is qualified for
MSL 1 according to IPC/JEDEC standard J-STD-020C.
During reflow, T
Pin must not exceed +260 °C at any time.
max 20 s over 230 °C
30-100 s over 221 °C
25 °C
Time
Temperature
Ramp-down
(cooling)
Ramp-up
Reflow
Preheat
Time 25 °C to peak
T
P
T
L
Profile features
Sn/Pb eutectic
assembly
Pb-free assembly
Average ramp-up rate
3 °C/s max
Solder melting
temperature (typical)
T
L
+183 °C
+221 °C
Peak product temperature T
P
+235 °C
+260 °C
Average ramp-down rate
4 °C/s max
Time 25 °C to peak
temperature
6 minutes max
8 minutes max
E
PKD 4000 ASI series
DC/DC converters, Input 36-75 V, Output 20 A/50 W
EN/LZT 146 346 R1A April 2006
Ericsson Power Modules AB
Technical Specication
16