参数资料
型号: PKS2113PI
厂商: ERICSSON POWER MODULES AB
元件分类: 电源模块
英文描述: 1-OUTPUT 15 W DC-DC REG PWR SUPPLY MODULE
文件页数: 7/12页
文件大小: 1280K
代理商: PKS2113PI
4
EN/LZT 146 28 R1A (Replaces EN/LZT 137 10 R7 Ericsson Microelectronics AB, June 2000
Thermal Data
The PKS 2000 series is designed for very low thermal resistance from
the internal components to the outer case. Copper traces with a
thickness of 70
mm (2 oz/ft2) are used on the ceramic substrate to
provide very low electrical resistance and excellent thermal conduc-
tivity. Tin plated copper leads are used for input and output
terminals and also conduct dissipated power to the copper pads on
the host printed circuit board. Consequently, the thermal perform-
ance of the PKS 2000 series can be enhanced by maximizing the
copper area around the pins of the power module. Figure 1 shows
recommended layout pattern which maximizes this copper area
(please refer to mechanical data for footprint dimensions). 70
mm
copper is recommended for optimum performance.
The ceramic substrate of the PKS 2000 series is also thermally
connected to a blue anodized aluminum case. By creating very low
thermal resistance, heat is readily conducted and evenly distributed
to the case. This prevents “hot spots” and allows the internal
component temperatures to remain close to the case temperature.
The thermal performance is very dependent on the amount of
ambient airflow. Air velocity in free convection is 0.2 – 0.3 m/s (40 –
60 lfm).
The PKS 2000 series are also protected from thermal overload by an
internal over-temperature shutdown circuit.
Over-Temperature Protection
When the internal junction temperature of the custom control IC
reaches 125 °C, the power module will automatically shut down. It
will automatically restart when the junction temperature cools below
115 °C.
Surface Mount Soldering Guidelines
The following guidelines apply when soldering the surface mount
DC/DC power modules. All the modules are designed to be compat-
ible with industry standard low temperature solder reflow processes
and industry standard aqueous or semi-aqueous wash systems. We
recommend a low tempeature 63% tin, 37% lead solder, or similar,
with a nominal melting point of 183 °C.
Ericsson uses a high temperature 96.5% tin, 3.5% silver solder with
a melting tempeature of 221 °C in the manufacturing process of the
DC/DC power modules. To avoid potential opens or shorts due to
internal solder reflow, use the following maximum reflow parameters:
– Preheat and cool-down rampsshould not exceed 2 °C/second to
prevent internal component failures due to thermal stress.
– If possible, avoid elevating the temperature above 220 °C (Leading
manufacturers of 63/37 solder with nominal 183 °C melting points
recommend maximum oven temperatures of 220 °C).
– If your reflow process creates DC/DC power module body tempera-
tures above 220 °C, then limit the time above this tempeature to a
maximum of 30 seconds.
– To avoid over-stressing internal components, do not exceed body
tempeatures of 230 °C during the reflow process.
Please contact your local Ericsson Sales office if you have questions or
need additional information.
Electrical Data
Single output
Fundamental circuit diagrams
ON/OFF
-VI
+VI
N/C
+VO
-VO
Solder Side Copper
Fig. 1
Top View (Component Side)
相关PDF资料
PDF描述
PKS2111PI 1-OUTPUT 15 W DC-DC REG PWR SUPPLY MODULE
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PKS2113SI 1-OUTPUT 15 W DC-DC REG PWR SUPPLY MODULE
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