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参数资料
| 型号： | PM300CLA060_05 |
| 厂商： | Mitsubishi Electric Corporation |
| 英文描述： | INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE |
| 中文描述： | 智能功率模块扁平性基地型绝缘包装 |
| 文件页数： | 8/8页 |
| 文件大小： | 137K |
| 代理商： | PM300CLA060_05 |
MITSUBISHI <INTELLIGENT POWER MODULES>
PM300CLA060
FLAT-BASE TYPE
INSULATED PACKAGE
May 2005
10
1
2
3
5
7
10
2
2
3
5
7
10
4
4
f
c
(kHz)
50
40
70
60
80
100
90
30
20
10
0
25
0
5
10
15
20
V
D
= 15V
T
j
= 25
°
C
N-side
P-side
EMITTER-COLLECTOR VOLTAGE V
EC
(V)
DIODE FORWARD CHARACTERISTICS
(INVERTER PART
·
TYPICAL)
10
3
7
5
4
I
D
(
0
0.5
1
1.5
2
2.5
V
D
= 15V
T
j
= 25
°
C
T
j
= 125
°
C
DIODE REVERSE RECOVERY CHARACTERISTICS
(INVERTER PART
·
TYPICAL)
10
0
7
5
4
T
j
= 125
°
C
Inductive load
COLLECTOR RECOVERY CURRENT
–
I
C
(A)
R
r
(
μ
s
R
r
(
10
–
2
3
2
10
–
1
7
5
4
3
2
10
1
10
3
7
5
4
3
2
10
2
7
5
4
3
2
t
rr
t
rr
t
rr
I
rr
I
rr
V
CC
= 300V
V
D
= 15V
T
j
= 25
°
C
10
1
10
2
3
2
7
5
4
3
2
I
rr
I
rr
C
–
I
C
(
I
D
VS. f
c
CHARACTERISTICS
(TYPICAL)
TRANSIENT THERMAL
IMPEDANCE CHARACTERISTICS
(INVERTER PART)
N
T
t
–
10
–
3
10
0
7
5
3
2
10
–
2
7
5
3
2
10
–
1
7
5
3
2
10
–
3
2 3 57
10
–
2
2 3 57
10
–
1
10
–
5
2 3 57
10
–
4
2 3 57
2 3 57
10
0
2 3 57
10
1
TIME
(s)
Single Pulse
IGBT Part;
Per unit base = R
th(j
–
c)Q
= 0.12
°
C/W
FWDi Part;
Per unit base = R
th(j
–
c)F
= 0.19
°
C/W
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相关代理商/技术参数 |
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|---|---|
| PM300CLA120 | 功能描述:MOD IPM L-SER 6PAC 1200V 300A RoHS:是 类别:半导体模块 >> 功率驱动器 系列:Intellimod™ 标准包装:15 系列:SPM® 类型:FET 配置:三相反相器 电流:1.8A 电压:500V 电压 - 隔离:1500Vrms 封装/外壳:23-DIP 模块 |
| PM300CLA120_05 | 制造商:MITSUBISHI 制造商全称:Mitsubishi Electric Semiconductor 功能描述:INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE |
| PM300CSD060 | 功能描述:MOD IPM 6PAC 600V 300A RoHS:是 类别:半导体模块 >> 功率驱动器 系列:Intellimod™ 标准包装:15 系列:SPM® 类型:FET 配置:三相反相器 电流:1.8A 电压:500V 电压 - 隔离:1500Vrms 封装/外壳:23-DIP 模块 |
| PM300CSE060 | 制造商:MITSUBISHI 制造商全称:Mitsubishi Electric Semiconductor 功能描述:INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE |
| PM300CSE060_05 | 制造商:MITSUBISHI 制造商全称:Mitsubishi Electric Semiconductor 功能描述:INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE |
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