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参数资料
| 型号： | PMC4518TWS/C |
| 厂商： | ERICSSON POWER MODULES AB |
| 元件分类： | 电源模块 |
| 英文描述： | 1-OUTPUT 52.8 W DC-DC REG PWR SUPPLY MODULE |
| 封装： | ROHS COMPLIANT, PACKAGE-6 |
| 文件页数： | 22/31页 |
| 文件大小： | 1655K |
| 代理商： | PMC4518TWS/C |
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EN/LZT146055R4A EricssonPowerModules,March2007
PMC4518TWSDatasheet
ThePMCseriesDC/DCregulatorsareintendedforreflowsoldering
processes.Extraprecautionsmustbetakenwhenreflowsoldering
themodule.Neglectingthesolderinginformationgivenbelow
mayresultinpermanentdamageorsignificantdegradationofthe
powermoduleperformance.Noresponsibilityisassumedifthese
recommendationsarenotstrictlyfollowed.
Themodulecanbereflowsolderedusingvapourphasereflow(VPR)
orforcedconvectionreflow.
Toensurepropersolderingoftheregulatorsthetemperatureshould
bemonitoredoninterconnectionpinGND.Theinterconnection
GNDisconsideredasrepresentativeduetotheheavycopperpath
characterisation.AthermocouplecanbeattachedtothepinGND
bymeansofasuitableadhesiveorheatconductivepaste,seethe
mechanicaldataonpage4.
Thereflowprofileshouldbeoptimisedtoavoidsolderpastedrying
andoverheatingofthemodule.Mostimportantistoensurethatthe
interconnectionpinsonthecoldestaerareachsufficientsoldering
temperatureforsufficientlylongtime.Asufficientlyextendedsoak
timeisrecommendedtoensureaneventemperaturethroughout
thePCB,forbothsmallandlargecomponents.Toreducetheriskof
overheatingthepowermodule,itisalsorecommendedtominimise
thetimeinreflowasmuchaspossible.
Forleadfreesolderprocesses(soldermeltingpoint217°C),
thePMCseriesisqualifiedforMSL1accordingtoJEDECstandard
“J-STD-020c”.Duringreflow,themoduletemperaturemustnot
exceed+245°Catanytime.
Soldering Information
ForconventionalSn-Pbsolderprocesses(soldermeltingpoint
179°C-183°C),ThePMCseriesisqualifiedforMSL1according
toJEDECstandard“J-STD-020c”.Duringreflow,themodule
temperaturemustnotexceed+225°Catanytime.
0
70
140
210
280
350
0
50
100
150
200
250
300
[°C]
Time
reflow ramp-up
cooling
zone
preheat
max 3°/s
soak zone
(150°C-200°C)
60-180s
reflow
zone
max pin temperature
@ 225°C (Low temp solder)
@ 245°C (High temp solder)
(solid line)-High temperature solder
(dashed line)-Low temperature solder
Rampup,ramp-downrate
Pre-heat
Soakzone
Reflowzone
Cooling
max3C/s
max0.5C/s
max3C/s
max4C/s
Temperatureinterval,time
Soakzone
Reflowzone
130-170C, 60-120 s
Above183C, 30-80 s
Peaktemperature,time
Reflowzone
210-225C, 10-30 s
Low temperature solder - reflow profile
Rampup,ramp-downrate
Pre-heat
Soakzone
Reflowzone
Cooling
max3C/s
max0.5C/s
max3C/s
max4C/s
Temperatureinterval,time
Soakzone
Reflowzone
150-200C, 60-180 s
Above220C, 30-80 s
Peaktemperature,time
Reflowzone
235-245C, 10-30 s
High temperature solders - Reflow profile
Pintemperatures,graphofthe4-zonesofreflowsoldering.
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