参数资料
型号: PMEG2010AEH,115
厂商: NXP Semiconductors
文件页数: 5/11页
文件大小: 70K
描述: SCHOTTKY RECT 20V 1A SOD123F
产品目录绘图: SOD-123F Pin Out
SOD-123F Circuit
标准包装: 3,000
二极管类型: 肖特基
电压 - (Vr)(最大): 20V
电流 - 平均整流 (Io): 1A(DC)
电压 - 在 If 时为正向 (Vf)(最大): 430mV @ 1A
速度: 快速恢复 =< 500 ns,> 200mA(Io)
电流 - 在 Vr 时反向漏电: 200µA @ 20V
电容@ Vr, F: 70pF @ 5V,1MHz
安装类型: 表面贴装
封装/外壳: SOD-123F
供应商设备封装: SOD-123F
包装: 带卷 (TR)
PMEG2010AEH_PMEG2010AET_3
? NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 03 — 28 March 2007 3 of 11
NXP Semiconductors
PMEG2010AEH; PMEG2010AET
1 A very low VF
MEGA Schottky barrier recti?ers
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR
are a signi?cant part of the total power losses.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4] Soldering point of cathode tab.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VR
reverse voltage - 20 V
IF
forward current Tsp
55
°C-1A
IFRM
repetitive peak forward current tp
1 ms;
δ≤0.25
PMEG2010AEH - 7 A
PMEG2010AET - 6 A
IFSM
non-repetitive peak forward
current
square wave;
tp
=8ms
-9A
Ptot
total power dissipation Tamb
≤25
°C
PMEG2010AEH
[1]
- 375 mW
[2]
- 830 mW
PMEG2010AET
[1]
- 280 mW
[2]
- 420 mW
Tj
junction temperature - 150
°C
Tamb
ambient temperature
?65 +150
°C
Tstg
storage temperature
?65 +150
°C
Table 7. Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air
[1]
PMEG2010AEH
[2]
- - 330 K/W
[3]
- - 150 K/W
PMEG2010AET
[2]
- - 440 K/W
[3]
- - 300 K/W
Rth(j-sp)
thermal resistance from
junction to solder point
[4]
PMEG2010AEH - - 60 K/W
PMEG2010AET - - 120 K/W
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