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参数资料
| 型号： | PPC5567MVR132 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 45/68页 |
| 文件大小： | 0K |
| 描述： | MCU 32BIT POWERPC 416-PBGA |
| 标准包装： | 200 |
| 系列： | MPC55xx Qorivva |
| 核心处理器： | e200z6 |
| 芯体尺寸： | 32-位 |
| 速度： | 132MHz |
| 连通性： | CAN，EBI/EMI，以太网，SCI，SPI |
| 外围设备： | DMA，POR，PWM，WDT |
| 输入/输出数： | 238 |
| 程序存储器容量： | 2MB（2M x 8） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 80K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 1.35 V ~ 1.65 V |
| 数据转换器： | A/D 40x12b |
| 振荡器型： | 外部 |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 416-BBGA |
| 包装： | 托盘 |
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Electrical Characteristics
MPC5567 Microcontroller Data Sheet, Rev. 2
Freescale
5
3.2
Thermal Characteristics
The shaded rows in the following table indicate information specific to a four-layer board.
26
Maximum operating temperature range 10
Die junction temperature
TJ
TL
150.0
oC
27
Storage temperature range
TSTG
–55.0
150.0
oC
28
Maximum solder temperature 11
Lead free (Pb-free)
Leaded (SnPb)
TSDR
—
260.0
245.0
oC
29
Moisture sensitivity level 12
MSL
—
3
1 Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,
and functional operation at the maxima is not guaranteed. Stress beyond any of the listed maxima can affect device reliability
or cause permanent damage to the device.
2 1.5 V ± 10% for proper operation. This parameter is specified at a maximum junction temperature of 150 oC.
3 All functional non-supply I/O pins are clamped to VSS and VDDE, or VDDEH.
4 AC signal overshoot and undershoot of up to ± 2.0 V of the input voltages is permitted for an accumulative duration of
60 hours over the complete lifetime of the device (injection current not limited for this duration).
5 Internal structures hold the voltage greater than –1.0 V if the injection current limit of 2 mA is met. Keep the negative DC
voltage greater than –0.6 V on SINB during the internal power-on reset (POR) state.
6 Internal structures hold the input voltage less than the maximum voltage on all pads powered by VDDEH supplies, if the
maximum injection current specification is met (2 mA for all pins) and VDDEH is within the operating voltage specifications.
7 Internal structures hold the input voltage less than the maximum voltage on all pads powered by VDDE supplies, if the maximum
injection current specification is met (2 mA for all pins) and VDDE is within the operating voltage specifications.
8 Total injection current for all pins (including both digital and analog) must not exceed 25 mA.
9 Total injection current for all analog input pins must not exceed 15 mA.
10 Lifetime operation at these specification limits is not guaranteed.
11 Moisture sensitivity profile per IPC/JEDEC J-STD-020D.
12 Moisture sensitivity per JEDEC test method A112.
Table 3. MPC5567 Thermal Characteristics
Spec
MPC5567 Thermal Characteristic
Symbol
Packages
Unit
324 PBGA 416 PBGA
1
Junction to ambient 1, 2, natural convection (one-layer board)
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
RJA
29
25
°C/W
2
Junction to ambient 1, 3, natural convection (four-layer board 2s2p)
RJA
19
17
°C/W
3
Junction to ambient (@200 ft./min., one-layer board)
RJMA
23
19
°C/W
4
Junction to ambient (@200 ft./min., four-layer board 2s2p)
RJMA
16
14
°C/W
5
Junction to board 4 (four-layer board 2s2p)
RJB
10
9
°C/W
6
Junction to case 5
RJC
77
°C/W
7
Junction to package top 6, natural convection
JT
22
°C/W
Table 2. Absolute Maximum Ratings 1 (continued)
Spec
Characteristic
Symbol
Min.
Max.
Unit
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