参数资料
型号: PSD4235F2-15UI
厂商: 意法半导体
英文描述: Flash In-System-Programmable Peripherals for 16-Bit MCUs
中文描述: Flash在系统可编程外设的16位微控制器
文件页数: 26/93页
文件大小: 503K
代理商: PSD4235F2-15UI
Preliminary Information
PSD4000 Series
23
The
PSD4000
Functional
Blocks
(cont.)
9.1.1.7 Unlock Bypass Instruction
The unlock bypass feature allows the system to program words to the flash memories
faster than using the standard program instruction. The unlock bypass instruction is
initiated by first writing two unlock cycles. This is followed by a third write cycle containing
the unlock bypass command, 20h (see Table 8). The flash memory then enters the unlock
bypass mode. A two-cycle Unlock Bypass Program instruction is all that is required to
program in this mode. The first cycle in this instruction contains the unlock bypass
programm command, A0h; the second cycle contains the program address and data.
Additional data is programmed in the same manner. This mode dispenses with the initial
two unlock cycles required in the standard program instruction, resulting in faster total pro-
gramming time. During the unlock bypass mode, only the Unlock Bypass Program and
Unlock Bypass Reset instructions are valid. To exit the unlock bypass mode, the system
must issue the two-cycle unlock bypass reset instruction. The first cycle must contain the
data 90h; the second cycle the data 00h. Addresses are don
t care for both cycles. The
flash memory then returns to reading array data mode.
9.1.1.8 Erasing Flash Memory
9.1.1.8.1. Flash Bulk Erase Instruction
The Flash Bulk Erase instruction uses six write operations followed by a Read operation of
the status register, as described in Table 8. If any byte of the Bulk Erase instruction is
wrong, the Bulk Erase instruction aborts and the device is reset to the Read Flash memory
status.
During a Bulk Erase, the memory status may be checked by reading status bits DQ5, DQ6,
and DQ7 (DQ13, DQ14, DQ15), as detailed in section 9.1.1.6. The Error bit (returns a
1
if
there has been an Erase Failure (maximum number of erase cycles have been executed).
It is not necessary to program the array with 00h because the PSD4000 will automatically
do this before erasing to 0FFh.
During execution of the Bulk Erase instruction, the Flash memory will not accept any
instructions.
9.1.1.8.2 Flash Sector Erase Instruction
The Sector Erase instruction uses six write operations, as described in Table 8. Additional
Flash Sector Erase confirm commands and Flash sector addresses can be written
subsequently to erase other Flash sectors in parallel, without further coded cycles, if the
additional instruction is transmitted in a shorter time than the timeout period of about
100 μs. The input of a new Sector Erase instruction will restart the time-out period.
The status of the internal timer can be monitored through the level of DQ3 (DQ11) (Erase
time-out bit). If DQ3 (DQ11) is
0
, the Sector Erase instruction has been received and the
timeout is counting. If DQ3 (DQ11) is
1
, the timeout has expired and the PSD4000 is busy
erasing the Flash sector(s). Before and during Erase timeout, any instruction other than
Erase suspend and Erase Resume will abort the instruction and reset the device to Read
Array mode. It is not necessary to program the Flash sector with 00h as the PSD4000 will
do this automatically before erasing.
During a Sector Erase, the memory status may be checked by reading status bits DQ5,
DQ6, and DQ7 (DQ13, DQ14, DQ15), as detailed in section 9.1.1.6.
During execution of the erase instruction, the Flash block logic accepts only Reset and
Erase Suspend instructions. Erasure of one Flash sector may be suspended, in order to
read data from another Flash sector, and then resumed.
相关PDF资料
PDF描述
PSD4235F2-70UI Flash In-System-Programmable Peripherals for 16-Bit MCUs
PSD4235F2-90B81 Flash In-System-Programmable Peripherals for 16-Bit MCUs
PSD4235F2-90B81I Flash In-System-Programmable Peripherals for 16-Bit MCUs
PSD4235F2-90J Flash In-System-Programmable Peripherals for 16-Bit MCUs
PSD4235F2-90JI Flash In-System-Programmable Peripherals for 16-Bit MCUs
相关代理商/技术参数
参数描述
PSD4235G2-70U 功能描述:SPLD - 简单可编程逻辑器件 5.0V 4M 70ns RoHS:否 制造商:Texas Instruments 逻辑系列:TICPAL22V10Z 大电池数量:10 最大工作频率:66 MHz 延迟时间:25 ns 工作电源电压:4.75 V to 5.25 V 电源电流:100 uA 最大工作温度:+ 75 C 最小工作温度:0 C 安装风格:Through Hole 封装 / 箱体:DIP-24
PSD4235G2-90U 功能描述:CPLD - 复杂可编程逻辑器件 5.0V 4M 90ns RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100
PSD4235G2-90UI 功能描述:CPLD - 复杂可编程逻辑器件 5.0V 4M 90ns RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100
PSD4235G2V-12UI 功能描述:CPLD - 复杂可编程逻辑器件 3.3V 4M 120ns RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100
PSD4235G2V-90U 功能描述:CPLD - 复杂可编程逻辑器件 3.3V 4M 90ns RoHS:否 制造商:Lattice 系列: 存储类型:EEPROM 大电池数量:128 最大工作频率:333 MHz 延迟时间:2.7 ns 可编程输入/输出端数量:64 工作电源电压:3.3 V 最大工作温度:+ 90 C 最小工作温度:0 C 封装 / 箱体:TQFP-100