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参数资料
| 型号： | PTH12020WAST |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 电源模块 |
| 英文描述： | 1-OUTPUT DC-DC REG PWR SUPPLY MODULE |
| 封装： | DIP-10 |
| 文件页数： | 23/27页 |
| 文件大小： | 930K |
| 代理商： | PTH12020WAST |
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PTH12020W TYPICAL CHARACTERISTICS (VI = 12 V)(1)(2)
50
60
70
80
90
100
0
3
6
9
12
15
18
Output
Ripple
mV
IO Load Current A
VO = 5 V
VO = 3.3 V
VO = 2.5 V
VO = 1.8 V
VO = 1.5 V
VO = 1.2 V
VO = 2 V
(See Note A)
50
60
70
80
90
100
0
3
6
9
12
15
18
VO = 5 V
VO = 3.3 V
VO = 2.5 V
VO = 2 V
VO = 1.8 V
VO = 1.5 V
VO = 1.2 V
Efficiency
%
IO Load Current A
(See Note A)
0
1
2
3
4
5
6
0
5
10
15
IO Load Current A
VO = 5 V
VO = 3.3 V
VO = 2.5 V
VO = 1.8 V
VO = 1.5 V
VO = 1.2 V
VO = 2 V
Power
Dissipation
W
P
D
15
(See Note A)
20
30
40
50
60
70
80
90
0
3
6
9
12
15
18
400 LFM
200 LFM
100 LFM
Nat Conv
VO = 2.5 V
T
A
Ambient
T
emperature
5
C
IO Load Current A
(See Note B)
20
30
40
50
60
70
80
90
0
3
6
9
12
15
18
400 LFM
200 LFM
100 LFM
Nat Conv
VO = 5 V
T
A
Ambient
T
emperature
5
C
IO Load Current A
(See Note B)
20
30
40
50
60
70
80
90
0
3
6
400 LFM
200 LFM
100 LFM
Nat Conv
VO = 1.8 V
T
A
Ambient
T
emperature
5
C
IO Load Current A
9
12
15
18
(See Note B)
www.ti.com ............................................................................................................................................................. SLTS208I – MAY 2003 – REVISED MARCH 2009
EFFICIENCY
OUTPUT RIPPLE
POWER DISSIPATION
vs
LOAD CURRENT
Figure 1.
Figure 2.
Figure 3.
TEMPERATURE DERATING
vs
OUTPUT CURRENT
Figure 4.
Figure 5.
Figure 6.
(1)
Note A: The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the
converter. Applies to Figure 1, Figure 2, and Figure 3.
(2)
Note B: The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's
maximum operating temperatures. Derating limits apply to modules soldered directly to a 4 inch × 4 inch double-sided PCB with 1oz.
copper. For surface mount products (AS and AZ suffix), multiple vias (plated through holes) are required to add thermal paths around
the power pins. Please refer to the mechanical specification for more information. Applies to Figure 4, Figure 5 and Figure 6.
Copyright 2003–2009, Texas Instruments Incorporated
5
Product Folder Link(s) :PTH12020W/L
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