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参数资料
| 型号： | QS90LD9M-29.000MHZ |
| 厂商： | Q-TECH CORP |
| 元件分类： | XO, clock |
| 英文描述： | CRYSTAL OSCILLATOR, CLOCK, 29 MHz, LVHCMOS OUTPUT |
| 封装： | ROHS COMPLIANT, HERMETIC SEALED, MINIATURE, CERAMIC, SMD, 4 PIN |
| 文件页数： | 5/6页 |
| 文件大小： | 315K |
| 代理商： | QS90LD9M-29.000MHZ |
5
Q-TECH Corporation - 10150 W. Jefferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-tech.com
QT90 SERIES
HIGH-RELIABILITY MINIATURE CLOCK OSCILLATORS
1.8 to 5.0Vdc
-
15kHz to 160MHz
Q-TECH
CORPORATION
QT90 (Revision H, January 2011) (ECO #10088)
Vdd
GND
0.1xVdd
0.9xVdd
VOH
VOL
TrTf
TH
T
0.5xVdd
SYMMETRY =
x 100%
TH
T
Output Waveform (Typical)
Frequency vs. Temperature Curve
Test Circuit
-
Output
Ground
4
3
2
0.1F
15pF
1
Tristate Function
Power
supply
10k
mA
Vdc
+
(*)
or
0.01F
QT90
(*) CL includes probe and jig capacitance
Typical test circuit for CMOS logic
Frequency vs.Temperature Curves QT90RD-65.00MHz
-40
-30
-20
-10
0
10
20
30
40
-55 -50 -45 -40 -35 -30 -25 -20 -15 -10
-5
05
10
15
20
25
30
35
Temp (C)
P
M
40
45
50
55
60
65
70
75
80
85
90
95 100 105 110 115 120 125
45
Hybrid Case
Substrate
Die
D/A epoxy
Heat
Die
R1
D/A epoxy
Substrate
D/A epoxy
Hybrid Case
R2
R3
R4
R5
Thermal Characteristics
JA
JC
CA
Die
T
C
A
J
CA
JC
(Figure 1)
(Figure 2)
The Tristate function on pin 1 has a built-in pull-up resistor typical 50k, so it can
be left floating or tied to Vdd without deteriorating the electrical performance.
The heat transfer model in a hybrid package is described in fig-
ure 1.
Heat spreading occurs when heat flows into a material layer of
increased cross-sectional area. It is adequate to assume that
spreading occurs at a 45° angle.
The total thermal resistance is calculated by summing the
thermal resistances of each material in the thermal path
between the device and hybrid case.
RT = R1 + R2 + R3 + R4 + R5
The total thermal resistance RT (see figure 2) between the heat
source (die) to the hybrid case is the Theta Junction to Case
(Theta JC) in°C/W.
Theta junction to case (Theta JC) for this product is 30°C/W.
Theta case to ambient (Theta CA) for this part is 100°C/W.
Theta Junction to ambient (Theta JA) is 130°C/W.
Maximum power dissipation PD for this package at 25°C is:
PD(max) = (TJ (max) – TA)/Theta JA
With TJ = 175°C (Maximum junction temperature of die)
PD(max) = (175 – 25)/130 = 1.15W
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