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参数资料
| 型号： | QSB363.YR |
| 厂商： | FAIRCHILD SEMICONDUCTOR CORP |
| 元件分类： | 光敏三极管 |
| 英文描述： | PHOTO TRANSISTOR DETECTOR |
| 封装： | PLASTIC PACKAGE-2 |
| 文件页数： | 5/5页 |
| 文件大小： | 84K |
| 代理商： | QSB363.YR |
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TOANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUMEANY LIABILITY
ARISING OUT OF THEAPPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT
CONVEYANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTENAPPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
ISOPLANAR
LittleFET
MICROCOUPLER
MicroFET
MicroPak
MICROWIRE
MSX
MSXPro
OCX
OCXPro
OPTOLOGIC
OPTOPLANAR
PACMAN
POP
Power247
PowerEdge
FAST
FASTr
FPS
FRFET
GlobalOptoisolator
GTO
HiSeC
I2C
i-Lo
ImpliedDisconnect
IntelliMAX
Rev. I17
ACEx
ActiveArray
Bottomless
Build it Now
CoolFET
CROSSVOLT
DOME
EcoSPARK
E2CMOS
EnSigna
FACT
FACT Quiet Series
PowerSaver
PowerTrench
QFET
QS
QT Optoelectronics
Quiet Series
RapidConfigure
RapidConnect
μSerDes
ScalarPump
SILENT SWITCHER
SMART START
SPM
Stealth
SuperFET
SuperSOT-3
SuperSOT-6
SuperSOT-8
SyncFET
TinyLogic
TINYOPTO
TruTranslation
UHC
UltraFET
UniFET
VCX
Wire
Across the board. Around the world.
The Power Franchise
Programmable Active Droop
相关PDF资料 |
PDF描述 |
|---|---|
| QSB363.GR | PHOTO TRANSISTOR DETECTOR |
| QSB363 | PHOTO TRANSISTOR DETECTOR |
| QSC133 | PHOTO DARLINGTON DETECTOR |
| QTLP321C-E | T-1 SINGLE COLOR LED, ORANGE, 3 mm |
| QTLP321C-Y | T-1 SINGLE COLOR LED, YELLOW, 3 mm |
相关代理商/技术参数 |
参数描述 |
|---|---|
| QSB363ZR | 功能描述:光电晶体管 Phototransistor Si Infrared RoHS:否 制造商:OSRAM Opto Semiconductors 最大功率耗散:165 mW 最大暗电流:200 nA 封装 / 箱体:T-1 |
| QSB373ZR | 功能描述:光电晶体管 T-3- 4 PHOTO XSTR DETECTOR RoHS:否 制造商:OSRAM Opto Semiconductors 最大功率耗散:165 mW 最大暗电流:200 nA 封装 / 箱体:T-1 |
| QSB-40-01 | 功能描述:风扇电线及配件 40mm EMI FILTR SHLD RoHS:否 制造商:ebm-papst 类型:Finger Guard 适合风扇大小:120 mm 系列: |
| QSB-40-01 | 制造商:Qualtek Electronics Corporation 功能描述:EMI FILTER SHIELD |
| QSB40024S05 | 功能描述:DC/DC CONVERTER 制造商:xp power 系列:QSB 包装:盒 零件状态:在售 类型:隔离模块 输出数:1 电压 - 输入（最小值）:9V 电压 - 输入（最大值）:36V 电压 - 输出 1:5V 电压 - 输出 2:- 电压 - 输出 3:- 电流 - 输出（最大值）:80A 功率（W）:400W 电压 - 隔离:1.5kV 应用:ITE（商业） 特性:远程开/关，OCP，OTP，OVP，SCP 工作温度:-40°C ~ 100°C 效率:87.5% 安装类型:通孔 封装/外壳:16-DIP 模块 大小/尺寸:4.60" 长 x 2.40" 宽 x 0.50" 高（116.8mm x 61.0mm x 12.7mm） 控制特性:使能，高电平有效 标准包装:1 |
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