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参数资料
| 型号： | R5109N271A-TR-FE |
| 厂商： | RICOH COMPANY LTD |
| 元件分类： | 电源管理 |
| 英文描述： | 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO8 |
| 封装： | HALOGEN FREE AND ROHS COMPLIANT, SSOP-8 |
| 文件页数： | 2/40页 |
| 文件大小： | 517K |
| 代理商： | R5109N271A-TR-FE |
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R510xx
10
R5107Gxx1A/C
Topt
=25°C
Symbol
Item
Conditions
Min.
Typ.
Max.
Unit
VDD
Operating Voltage
0.9
6.0
V
ISS
Supply Current
VDD
= -VDET+0.5V,
Clock pulse input
11
15
μA
VD Part
Symbol
Item
Conditions
Min.
Typ.
Max.
Unit
Topt
=25°C
×0.990
×1.010
-VDET
Detector Threshold
40°C ≤ Topt ≤ 105°C
×0.972
×1.015
V
VHYS
Detector Threshold Hysteresis
-VDET
×0.03
-VDET
×0.05
-VDET
×0.07
V
Δ-VDET/
ΔTopt
Detector Threshold
Temperature Coefficient
40°C ≤ Topt ≤ 105°C
±100
ppm/
°C
tPLH
Output Delay Time
CD
=0.1μF 1
340
370
467
ms
Nch
VDD
=1.2V, VDS=0.1V
0.38
0.8
mA
IRESETB
Output Current
(RESETB Output pin)
Pch
2
VDD
=6.0V, VDS=0.5V
0.65
0.9
mA
VMRH
MR Input "H"
3
1.0
6.0
V
VMRL
MR Input "L"
0
0.35
V
tMRW
MR Input Pulse Width
4
3
μs
RMR
MR Pull-up Resistance
60
110
164
k
Ω
WDT Part
Symbol
Item
Conditions
Min.
Typ.
Max.
Unit
tWD
Watchdog Timeout period
CTW
=0.1μF 1
230
310
450
ms
tWR
Reset Hold Time of WDT
CTW
=0.1μF 1
29
34
48
ms
VSCKH
SCK Input "H"
VDD
×0.8
6.0
V
VSCKL
SCK Input "L"
0
VDD
×0.2
V
VINHH
INH Input "H"
1.0
6.0
V
VINHL
INH Input "L"
0
0.35
V
RINH
INH pull-up Resistance
64
110
152
k
Ω
tSCKW
SCK Input Pulse Width
VSCKL
=VDD×0.2
VSCKH
=VDD×0.8
500
ns
All of unit are tested and specified under load conditions such that Topt
=25°C except for Detector Threshold
Temperature Coefficient and MR Input Pulse Width.
1) The specification does not contain the temperature characteristics of the external capacitor.
2) In case of CMOS type (R5107Gxx1C)
3) In case of Nch open drain type (R5107Gxx1A)
4) MR input pulse width specification guarantee the minimum input pulse width of MR pin for output "L" from RESETB pin.
If the "L" pulse width of MR is short, tPLH may be short. Refer to the timing diagram for details.
RECOMMENDED OPERATING CONDITIONS
(ELECTRICAL CHARACTERISTICS)
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the
recommended operating conditions, even if when they are used over such conditions by momentary
electronic noise or surge. And the semiconductor devices may receive serious damage when they continue
to operate over the recommended operating conditions.
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