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| 型号： | RA06H8285M-E01 |
| 厂商： | Electronic Theatre Controls, Inc. |
| 英文描述： | MITSUBISHI RF MOSFET MODULE |
| 中文描述： | 三菱射频MOSFET模块 |
| 文件页数： | 7/8页 |
| 文件大小： | 66K |
| 代理商： | RA06H8285M-E01 |
MITSUBISHI RF POWER MODULE
R A06H8285M
RA06H8285M
MITSUBISHI ELECTRIC
7/9
23 Dec 2002
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
PRECAUTIONS, RECOMMENDATIONS, and APPLICATION INFORMATION:
Construction:
This module consists of an alumina substrate soldered onto a copper flange. For mechanical protection, a plastic
cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate,
and coated with resin. Lines on the substrate (eventually inductors), chip capacitors, and resistors form the bias and
matching circuits. Wire leads soldered onto the alumina substrate provide the DC and RF connection.
Following conditions must be avoided:
a) Bending forces on the alumina substrate (for example, by driving screws or from fast thermal changes)
b) Mechanical stress on the wire leads (for example, by first soldering then driving screws or by thermal expansion)
c) Defluxing solvents reacting with the resin coating on the MOSFET chips (for example, Trichlorethylene)
d) Frequent on/off switching that causes thermal expansion of the resin
e) ESD, surge, overvoltage in combination with load VSWR, and oscillation
ESD:
This MOSFET module is sensitive to ESD voltages down to 1000V. Appropriate ESD precautions are required.
Mounting:
Heat sink flatness must be less than 50 μm (a heat sink that is not flat or particles between module and heat sink
may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws
or later when thermal expansion forces are added).
A thermal compound between module and heat sink is recommended for low thermal contact resistance and to
reduce the bending stress on the ceramic substrate caused by the temperature difference to the heat sink.
The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board.
M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm.
Soldering and Defluxing:
This module is designed for manual soldering.
The leads must be soldered after the module is screwed onto the heat sink.
The soldering temperature must be lower than 260°C for a maximum of 10 seconds, or lower than 350°C for a
maximum of three seconds.
Ethyl Alcohol is recommend for removing flux. Trichlorethylene solvents must not be used (they may cause bubbles
in the coating of the transistor chips which can lift off the bond wires).
Thermal Design of the Heat Sink:
Now Preparing
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相关代理商/技术参数 |
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|---|---|
| RA-06-K | 制造商:DBLECTRO 制造商全称:DB Lectro Inc 功能描述:RIGHT ANGLE TYPE DIP SWITCH |
| RA-06-K-T | 制造商:DBLECTRO 制造商全称:DB Lectro Inc 功能描述:RIGHT ANGLE TYPE DIP SWITCH |
| RA-06-R | 制造商:DBLECTRO 制造商全称:DB Lectro Inc 功能描述:RIGHT ANGLE TYPE DIP SWITCH |
| RA-06-R-T | 制造商:DBLECTRO 制造商全称:DB Lectro Inc 功能描述:RIGHT ANGLE TYPE DIP SWITCH |
| RA-07 | 制造商:DBLECTRO 制造商全称:DB Lectro Inc 功能描述:RIGHT ANGLE TYPE DIP SWITCH |
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