参数资料
型号: REG101
厂商: Texas Instruments, Inc.
英文描述: DMOS 100mA Low-Dropout Regulator
中文描述: 的DMOS 100mA的低压差稳压器
文件页数: 13/15页
文件大小: 277K
代理商: REG101
REG101
SBVS026C
13
FIGURE 7. Maximum Power Dissipation versus Ambient Temperature for the Various Packages.
POWER DISSIPATION
The REG101 is available in two different package configu-
rations. The ability to remove heat from the die is different
for each package type and, therefore, presents different
considerations in the printed circuit-board layout. The PCB
area around the device that is free of other components
moves the heat from the device to the ambient air. While it
is difficult-to-impossible to quantify all of the variables in a
thermal design of this type, performance data for several
configurations are shown in Figure 7.
Power dissipation depends on input voltage, load condition,
and duty cycle. Power dissipation is equal to the product of
the average output current times the voltage across the
output element, V
IN
to V
OUT
voltage drop.
Power dissipation can be minimized by using the lowest
possible input voltage necessary to assure the required
output voltage.
REGULATOR MOUNTING
Solder pad footprint recommendations for the various
REG101 devices are presented in the Application Bulletin
AB-132, “Solder Pad Recommendations for Surface-Mount
Devices” (SBFA015), available from the Texas Instruments
web site (www.ti.com).
1.2
1.0
0.8
0.6
0.4
0.3
0
P
0
25
50
75
100
125
Ambient Temperature (
°
C)
CONDITIONS
SOT23-5
SO-8
PACKAGE
SOT23-5
SO-8
JA
200
°
C/W
150
°
C/W
θ
P = V
– V
I
IN
OUT
OUT(AVG)
)
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相关代理商/技术参数
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