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参数资料
| 型号： | RF3315PCBA-411 |
| 厂商： | RF Micro Devices, Inc. |
| 英文描述： | ROADBAND HIGH LINEARITY AMPLIFIER |
| 中文描述： | ROADBAND高线性功率放大器 |
| 文件页数： | 12/12页 |
| 文件大小： | 228K |
| 代理商： | RF3315PCBA-411 |
4-568
RF3315
Rev A9 050310
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the
PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all
pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask
clearance can be provided in the master data or requested from the PCB fabrication supplier.
Thermal Pad and Via Design
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating
routing strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size
on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested
that the quantity of vias be increased by a 4:1 ratio to achieve similar results.
A = 1.37 x 0.96 (mm) Typ.
Dimensions in mm.
Pin 1
A
A
1.48
3.48
2.892.44
1.020.48
5.46
1.88 Typ.
0.72 Typ.
0.03
Figure 2. PCB Solder Mask Pattern (Top View)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| RF3315PCK-411 | 制造商:RF Micro Devices Inc 功能描述:KIT EVAL FOR RF3315 900MHZ |
| RF3315TR7 | 制造商:RF Micro Devices Inc 功能描述:IC AMP HBT GAAS BROADBAND SOT-89 |
| RF3316-000 | 制造商:TE Connectivity 功能描述:- Bag |
| RF3319 | 功能描述:信号调节 868.95MHz Narrowband Receiver Front End RoHS:否 制造商:EPCOS 产品:Duplexers 频率:782 MHz, 751 MHz 频率范围: 电压额定值: 带宽: 阻抗:50 Ohms 端接类型:SMD/SMT 封装 / 箱体:2.5 mm x 2 mm 工作温度范围:- 30 C to + 85 C 封装:Reel |
| RF3319-000 | 制造商:TE Connectivity 功能描述:RHEF800 - Bag |
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