参数资料
型号: RM805-17
厂商: SKYWORKS SOLUTIONS INC
元件分类: 放大器
英文描述: 806 MHz - 849 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
封装: 10 X 13.97 MM, 1.70 MM HEIGHT, PLASTIC, LCC-28
文件页数: 7/10页
文件大小: 226K
代理商: RM805-17
Package Dimensions and Pin Descriptions
RM805
Power Amplifier Module for Broadband
6
Skyworks Solutions, Inc., Proprietary
101505D
December 6, 2002
Table 4. Pin Names and Descriptions
Pad
Name
Description
1
VREG1
Regulated bias enable control voltage, 0.0=Off, 2.75V=On
2
VCNTL
Reserved for gain adjust control, currently a floating pad
3
GND1
Low Inductance Ground Connection
4
GND2
Low Inductance Ground Connection
5
RFIN
806-849 MHz RF input signal (typically -8 dBm) 50 Ohm
6
GND3
Low Inductance Ground Connection
7
VREG2
Reserved for additional VREG signal, currently a floating pad
8
VD3
Supply voltage for driver collector bias (typically 3.5V)
9
GND4
Low Inductance Ground Connection
10
RSVD
Used to identify device, Skyworks pad must float
11
GND5
Low Inductance Ground Connection
12
GND6
Low Inductance Ground Connection
13
GND7
Low Inductance Ground Connection
14
VD1
Unused supply voltage, currently a floating pad
15
RFOUT
806-849 MHz RF output signal (typically +29 dBm) 50 Ohm
16
GND8
Low Inductance Ground Connection
17
GND9
Low Inductance Ground Connection
18
GND10
Low Inductance Ground Connection
19
GND11
Low Inductance Ground Connection
20
GND12
Low Inductance Ground Connection
21
GND13
Low Inductance Ground Connection
22
VD2
Supply voltage for output (final) stage collector bias (typically 3.5V)
23
GND14
Low Inductance Ground Connection
24
GND15
Low Inductance Ground Connection
25
GND16
Low Inductance Ground Connection
26
GND17
Low Inductance Ground Connection
27
GND18
Low Inductance Ground Connection
28
VD4
Supply voltage for base bias circuitry to all stages (typically 3.5V)
NOTE(S):
Center attachment pad must have a low inductance and low thermal resistance connection to the
customer's printed circuit board ground plane.
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