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参数资料
| 型号： | RM805-17 |
| 厂商： | SKYWORKS SOLUTIONS INC |
| 元件分类： | 放大器 |
| 英文描述： | 806 MHz - 849 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封装： | 10 X 13.97 MM, 1.70 MM HEIGHT, PLASTIC, LCC-28 |
| 文件页数： | 8/10页 |
| 文件大小： | 226K |
| 代理商： | RM805-17 |
RM805
Package and Handling Information
Power Amplifier Module for Broadband
101505D
Skyworks Solutions, Inc., Proprietary
7
December 6, 2002
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum packed
prior to shipment. Instructions on the shipping container label must be followed regarding exposure
to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly.
The RM805 is capable of withstanding an MSL 3/225 °C solder reflow. Care must be taken when
attaching this product, whether it is done manually or in a production solder reflow environment. If
the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 °C per second;
maximum temperature should not exceed 225 °C. If the part is manually attached, precaution
should be taken to insure that the part is not subjected to temperatures exceeding 225 °C for more
than 10 seconds. For details on both attachment techniques, precautions, and handling procedures
recommended by Skyworks, please refer to Application Note: PCB Design and SMT
Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles
can also be found in the JEDEC Standard J–STD–020A.
Production quantities of this product are shipped in the standard tape-and-reel format. For
packaging details, refer to Application Note: Tape and Reel, Document Number 101568.
Figure 4. Typical Case Markings
101505_008
CONEXANT
RM805-NN
EXXXXX.XX
YYWW MEX
Manufacturing
Part Number-Revision Number
Mark Pin 1
Identifier
Lot Number
YY
= Manufacture Year
WW = Week Package
Sealed
MEX = Country Code
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