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参数资料
| 型号： | RPS1H330MCN1GS |
| 厂商： | Nichicon |
| 文件页数： | 5/60页 |
| 文件大小： | 0K |
| 描述： | CAP ALUM 33UF 50V 20% SMD |
| 标准包装： | 1 |
| 系列： | PS |
| 电容： | 33µF |
| 额定电压： | 50V |
| 容差： | ±20% |
| 寿命@温度： | 105°C 时为 2000 小时 |
| 工作温度： | -55°C ~ 105°C |
| 特点： | 聚合物 |
| 纹波电流： | 1.95A |
| ESR（等效串联电阻）： | 32 毫欧 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 径向，Can - SMD |
| 尺寸/尺寸： | 0.394" 直径（10.00mm） |
| 高度 - 座高（最大）： | 0.315"（8.00mm） |
| 表面贴装占地面积： | 0.406" L x 0.406" W（10.30mm x 10.30mm） |
| 包装： | 标准包装 |
| 其它名称： | 493-6649-6 |
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Precautions
2. Mounting precautions
(1) Things to know before mounting
a) Do not reuse the FPCAP that has already been assembled in a device and energized.
Excluding the FPCAP that has been removed for measuring electrical characteristics during a periodic inspection,
they cannot be reused.
b) Leakage current may increase if the part has been stored for a long period of time.
In this case, use after voltage treatment under the rated voltage.
(2) Mounting-1
a) Mount after checking the capacitance and the rated voltage.
b) Mount after checking the polarity.
c) Do not drop on the floor and do not use parts that have been dropped.
d) Do not deform and then mount.
(3) Mounting-2
a) Mount after checking the match between the lead pitch and the PC board holes pitch.
b) When an automatic insertion equipment is used to clinch the lead wires, make sure it is set correctly.
c) Be careful of the shock force that can be produced by the automatic insertion equipment.
d) Do not apply excessive external force to the lead wires, the FPCAP itself, or the electrode terminals.
(4) Soldering with a soldering iron
a) Set the soldering conditions (temperature, time) so that they fall within the range stipulated by the catalog specification.
b) When the lead wire terminal must be processed because the terminal spacing and the PC board holes spacing do not match,
process it before soldering so that no stress is applied to the FPCAP itself.
c) Do not subject the FPCAP itself to excessive stress when soldering with a soldering iron.
d) When a soldering iron is used to repair the FPCAP that has already been soldered once and needs to be removed,
do it after the solder has been completely melted so that no stress is applied to the FPCAP terminals.
e) Do not let the tip of the soldering iron touch the FPCAP itself.
f ) The amount of leakage current after soldering may increase a slightly (from a few μ A to several hundred μ A) depending
on the soldering condition (preheating and solder temperature and time, PC board material and thickness, etc.)
The leakage current can be reduced by applying voltage.
(5) Flow soldering (Radial lead type)
a) Never submerge the FPCAP in molten solder. Use the PC board to protect the FPCAP and only solder the opposite side
of the board that the FPCAP is mounted on.
b) Set the soldering conditions (soldering temperature, terminal submersion time) so that they fall within the range stipulated
by the catalog specification. The amount of leakage current after soldering may increase slightly (from a few μ A to several
hundred μ A) depending on the soldering conditions (preheating and solder temperature and time, PC board material and
thickness, etc.). The leakage current can be reduced through self-repair by applying voltage.
c) Take care that flux does not adhere to any place other than the terminals.
d) When soldering, take care that other components do not fall over and touch the FPCAP.
e) Flow soldering under extremely abnormal conditions may reduce the capacitance of products before or after soldering.
(6) Reflow soldering (SMD type)
Do not use reflow soldering for Radial lead type (Through Hole).
a) Never submerge the FPCAP in molten solder. Use the PC board to protect the FPCAP and only solder the opposite side
of the board that the FPCAP is mounted on.
b) Set the soldering conditions (soldering temperature, terminal submersion time) so that they fall within the range stipulated
by the catalog specification. The amount of leakage current after soldering may increase slightly (from a few μ A to several
hundred μ A) depending on the soldering conditions (preheating and solder temperature and time, PC board material and
thickness, etc.). The leakage current can be reduced through self-repair by applying voltage.
c) Take care that flux does not adhere to any place other than the terminals.
d) When soldering, take care that other components do not fall over and touch the FPCAP .
e) Reflow soldering under extremely abnormal conditions may reduce the capacitance of products before or after soldering.
f) Do not use VPS (Vapor Phase Soldering).
NICHICON CORPORATION / FPCAP ELECTRONICS (SUZHOU) CO., LTD.
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| RPS1H390MCN1GS | 功能描述:39μF 50V Aluminum - Polymer Capacitors Radial, Can - SMD 26 mOhm 2000 Hrs @ 105°C 制造商:nichicon 系列:FPCAP，RPS 包装:剪切带（CT） 零件状态:有效 电容:39μF 容差:±20% 额定电压:50V ESR（等效串联电阻）:26 毫欧 不同温度时的使用寿命:105°C 时为 2000 小时 工作温度:-55°C ~ 105°C 极化:极化 应用:通用 纹波电流:2.3A 阻抗:- 引线间距:- 大小/尺寸:0.315" 直径（8.00mm） 高度 - 安装（最大值）:0.472"（12.00mm） 表面贴装焊盘尺寸:0.327" 长 x 0.327" 宽（8.30mm x 8.30mm） 安装类型:表面贴装 封装/外壳:径向，Can - SMD 标准包装:1 |
| RPS1H470MCN1GS | 功能描述:铝有机聚合物电容器 47UF 50V 20% RoHS:否 制造商:Panasonic Electronic Components 电容:470 uF 容差:20 % 电压额定值:2.5 V ESR:4.5 mOhms 工作温度范围:- 40 C to + 105 C 端接类型:SMD/SMT 外壳直径: 外壳长度:7.3 mm 外壳宽度:4.3 mm 外壳高度:1.9 mm 封装:Reel |
| RPS1H820MCN1GS | 功能描述:铝有机聚合物电容器 82UF 50V 20% RoHS:否 制造商:Panasonic Electronic Components 电容:470 uF 容差:20 % 电压额定值:2.5 V ESR:4.5 mOhms 工作温度范围:- 40 C to + 105 C 端接类型:SMD/SMT 外壳直径: 外壳长度:7.3 mm 外壳宽度:4.3 mm 外壳高度:1.9 mm 封装:Reel |
| RPS1J120MCN1GS | 功能描述:铝有机聚合物电容器 12UF 63V 20% RoHS:否 制造商:Panasonic Electronic Components 电容:470 uF 容差:20 % 电压额定值:2.5 V ESR:4.5 mOhms 工作温度范围:- 40 C to + 105 C 端接类型:SMD/SMT 外壳直径: 外壳长度:7.3 mm 外壳宽度:4.3 mm 外壳高度:1.9 mm 封装:Reel |
| RPS1J220MCN1GS | 功能描述:铝有机聚合物电容器 22UF 63V 20% RoHS:否 制造商:Panasonic Electronic Components 电容:470 uF 容差:20 % 电压额定值:2.5 V ESR:4.5 mOhms 工作温度范围:- 40 C to + 105 C 端接类型:SMD/SMT 外壳直径: 外壳长度:7.3 mm 外壳宽度:4.3 mm 外壳高度:1.9 mm 封装:Reel |
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