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参数资料
| 型号： | RXM-869-ES_ |
| 厂商： | Linx Technologies Inc |
| 文件页数： | 13/20页 |
| 文件大小： | 0K |
| 描述： | RECEIVER RF 869MHZ 16PIN SMD |
| 标准包装： | 25 |
| 频率： | 869MHz |
| 灵敏度： | -102dBm |
| 数据传输率 - 最大： | 56 kbps |
| 调制或协议： | FM，FSK |
| 电流 - 接收： | 6.5mA |
| 数据接口： | PCB，表面贴装 |
| 天线连接器： | PCB，表面贴装 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 16-SMD |
| 供应商设备封装： | 模块 |
| 包装： | 管件 |
| 其它名称： | RXM-869-ES RXM-869-ES_-ND |
AUTOMATED ASSEMBLY
For high-volume assembly, most users will want to auto-place the modules. The
modules have been designed to maintain compatibility with reflow processing
techniques; however, due to the their hybrid nature, certain aspects of the
assembly process are far more critical than for other component types.
Following are brief discussions of the three primary areas where caution must be
observed.
Reflow Temperature Profile
The single most critical stage in the automated assembly process is the reflow
stage. The reflow profile below should not be exceeded, since excessive
temperatures or transport times during reflow will irreparably damage the
modules. Assembly personnel will need to pay careful attention to the oven’s
profile to ensure that it meets the requirements necessary to successfully reflow
all components while still remaining within the limits mandated by the modules.
The figure below shows the recommended reflow oven profile for the modules.
300
250
200
255°C
235°C
217°C
185°C
Recommended RoHS Profile
Max RoHS Profile
Recommended Non-RoHS Profile
180°C
150
125°C
100
50
0
30
60
90
120
150
180
210
240
270
300
330
360
Time ( S econd s )
Figure 16: Maximum Reflow Profile
Shock During Reflow Transport
Since some internal module components may reflow along with the components
placed on the board being assembled, it is imperative that the modules not be
subjected to shock or vibration during the time solder is liquid. Should a shock
be applied, some internal components could be lifted from their pads, causing
the module to not function properly.
Washability
The modules are wash resistant, but are not hermetically sealed. Linx
recommends wash-free manufacturing; however, the modules can be subjected
to a wash cycle provided that a drying time is allowed prior to applying electrical
power to the modules. The drying time should be sufficient to allow any moisture
that may have migrated into the module to evaporate, thus eliminating the
potential for shorting damage during power-up or testing. If the wash contains
contaminants, the performance may be adversely affected, even after drying.
Page 13
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相关代理商/技术参数 |
参数描述 |
|---|---|
| RXM-869-ES_ | 功能描述:RECEIVER RF 869MHZ 16PIN SMD RoHS:是 类别:RF/IF 和 RFID >> RF 接收器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS 产品变化通告:Product Discontinuation 09/Jan/2012 标准包装:50 系列:* 频率:850MHz ~ 2.175GHz 灵敏度:- 数据传输率 - 最大:- 调制或协议:- 应用:* 电流 - 接收:* 数据接口:PCB，表面贴装 存储容量:- 天线连接器:PCB，表面贴装 特点:- 电源电压:4.75 V ~ 5.25 V 工作温度:0°C ~ 85°C 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP（6x6） 包装:托盘 |
| RXM-900-HP3 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:HP3 SERIES RECEIVER MODULE DATA |
| RXM-900-HP3-PPO | 功能描述:射频模块 RF Receiver 900MHz 8-CH SIP Pack RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm |
| RXM-900-HP3-PPO_ | 功能描述:RECEIVER RF 900MHZ 8-CHANNEL RoHS:是 类别:RF/IF 和 RFID >> RF 接收器 系列:HP3 产品培训模块:Lead (SnPb) Finish for COTS 产品变化通告:Product Discontinuation 09/Jan/2012 标准包装:50 系列:* 频率:850MHz ~ 2.175GHz 灵敏度:- 数据传输率 - 最大:- 调制或协议:- 应用:* 电流 - 接收:* 数据接口:PCB，表面贴装 存储容量:- 天线连接器:PCB，表面贴装 特点:- 电源电压:4.75 V ~ 5.25 V 工作温度:0°C ~ 85°C 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP（6x6） 包装:托盘 |
| RXM-900-HP3-PPS | 功能描述:射频模块 RF Receiver 900MHz 8 & 100-CH SIP Pack RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm |
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