参数资料
型号: S29GL032M10BCIR32
厂商: SPANSION LLC
元件分类: PROM
英文描述: MirrorBit Flash Family
中文描述: 2M X 16 FLASH 3V PROM, 100 ns, PBGA48
封装: LEAD FREE, BGA-48
文件页数: 18/162页
文件大小: 4557K
代理商: S29GL032M10BCIR32
114
S29GLxxxM MirrorBitTM Flash Family
S29GLxxxM_00A4 March 30, 2004
Pr e l i m i n a r y
Table 32. Command Definitions (x8 Mode, BYTE# = VIL)
Command
Sequence
(Note 1)
Cy
cl
e
s
Bus Cycles (Notes 2–5)
First
Second
Third
Fourth
Fifth
Sixth
Addr Data
Addr
Data
Addr
Data
Addr
Data
Addr
Data Addr Data
1RA
RD
Reset (Note 7)
1
XXX
F0
Au
to
se
le
ct
(
N
o
te
8
)
Manufacturer ID
4
AAA
AA
555
55
AAA
90
X00
01
Device ID (Note 9)
4
AAA
AA
555
55
AAA
90
X02
7E
X1C
X1E
SecSi‰ Sector Factory
Protect (Note 10)
4
AAA
AA
555
55
AAA
90
X06
(Note 10)
Sector Group Protect Verify
4
AAA
AA
555
55
AAA
90
(SA)X04
00/01
Enter SecSi Sector Region
3
AAA
AA
555
55
AAA
88
Exit SecSi Sector Region
4
AAA
AA
555
55
AAA
90
XXX
00
Write to Buffer (Note 11)
3
AAA
AA
555
55
SA
25
SA
BC
PA
PD
WBL
PD
Program Buffer to Flash
1SA
29
Write to Buffer Abort Reset (Note
3
AAA
AA
555
55
AAA
F0
Chip Erase
6
AAA
AA
555
55
AAA
80
AAA
AA
555
55
AAA
10
Sector Erase
6
AAA
AA
555
55
AAA
80
AAA
AA
555
55
SA
30
Program/Erase Suspend (Note
1
XXX
B0
Program/Erase Resume (Note
1
XXX
30
CFI Query (Note 16)
1AA
98
Legend:
X = Don’t care
RA = Read Address of memory location to be read.
RD = Read Data read from location RA during read operation.
PA = Program Address. Addresses latch on falling edge of WE# or
CE# pulse, whichever happens later.
PD = Program Data for location PA. Data latches on rising edge of
WE# or CE# pulse, whichever happens first.
SA = Sector Address of sector to be verified (in autoselect mode) or
erased. Address bits A21–A15 uniquely select any sector.
WBL = Write Buffer Location. Address must be within same write
buffer page as PA.
WC = Word Count. Number of write buffer locations to load minus 1.
Notes:
1. See Table 1 for description of bus operations.
2. All values are in hexadecimal.
3. Shaded cells indicate read cycles. All others are write cycles.
4. During unlock and command cycles, when lower address bits are
555 or 2AA as shown in table, address bits above A11 and data
bits above DQ7 are don’t care.
5. No unlock or command cycles required when device is in read
mode.
6. Reset command is required to return to read mode (or to erase-
suspend-read mode if previously in Erase Suspend) when device
is in autoselect mode, or if DQ5 goes high while device is
providing status information.
7. Fourth cycle of the autoselect command sequence is a read
cycle. Data bits DQ15–DQ8 are don’t care. Except for RD, PD
and WC. See Autoselect Command Sequence section for more
information.
8. Device ID must be read in three cycles.
9. If WP# protects highest address sector, data is 98h for factory
locked and 18h for not factory locked. If WP# protects lowest
address sector, data is 88h for factory locked and 08h for not
factor locked.
10. Data is 00h for an unprotected sector group and 01h for a
protected sector group.
11. Total number of cycles in command sequence is determined by
number of words written to write buffer. Maximum number of
cycles in command sequence is 21.
12. Command sequence resets device for next command after
aborted write-to-buffer operation.
13. Unlock Bypass command is required prior to Unlock Bypass
Program command.
14. Unlock Bypass Reset command is required to return to read
mode when device is in unlock bypass mode.
15. System may read and program in non-erasing sectors, or enter
autoselect mode, when in Erase Suspend mode. Erase Suspend
command is valid only during a sector erase operation.
16. Erase Resume command is valid only during Erase Suspend
mode.
17. Command is valid when device is ready to read array data or
when device is in autoselect mode.
18. Refer to Table 14, AutoSelect Codes for individual Device IDs
per device density and model number.
相关PDF资料
PDF描述
S29GL032M10BCIR33 Conductive Polymer Chip Capacitors / T520 Series - High Temperature; Capacitance [nom]: 470uF; Working Voltage (Vdc)[max]: 4V; Capacitance Tolerance: +/-20%; Dielectric: Conductive Polymer; ESR: 40mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-31; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 2.8mm; Temperature Range: -55C to +125C; Container: Tape & Reel; Qty per Container: 500; Features: Low Temperature
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