参数资料
型号: S29GL032M10BFIR22
厂商: SPANSION LLC
元件分类: PROM
英文描述: T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 220uF; Working Voltage (Vdc)[max]: 4V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 12mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
中文描述: 2M X 16 FLASH 3V PROM, 100 ns, PBGA64
封装: 13 X 11 MM, LEAD FREE, FORTIFIED BGA-64
文件页数: 106/158页
文件大小: 4695K
代理商: S29GL032M10BFIR22
August 4, 2004 S29GLxxxM_00_B1_E
S29GLxxxM MirrorBitTM Flash Family
51
Da ta shee t
SA108
1101100xxx
64/32
6C0000h–6CFFFFh
360000h–367FFFh
SA109
1101101xxx
64/32
6D0000h–6DFFFFh
368000h–36FFFFh
SA110
1101110xxx
64/32
6E0000h–6EFFFFh
370000h–377FFFh
SA111
1101111xxx
64/32
6F0000h–6FFFFFh
378000h–37FFFFh
SA112
1110000xxx
64/32
700000h–70FFFFh
380000h–387FFFh
SA113
1110001xxx
64/32
710000h–71FFFFh
388000h–38FFFFh
SA114
1110010xxx
64/32
720000h–72FFFFh
390000h–397FFFh
SA115
1110011xxx
64/32
730000h–73FFFFh
398000h–39FFFFh
SA116
1110100xxx
64/32
740000h–74FFFFh
3A0000h–3A7FFFh
SA117
1110101xxx
64/32
750000h–75FFFFh
3A8000h–3AFFFFh
SA118
1110110xxx
64/32
760000h–76FFFFh
3B0000h–3B7FFFh
SA119
1110111xxx
64/32
770000h–77FFFFh
3B8000h–3BFFFFh
SA120
1111000xxx
64/32
780000h–78FFFFh
3C0000h–3C7FFFh
SA121
1111001xxx
64/32
790000h–79FFFFh
3C8000h–3CFFFFh
SA122
1111010xxx
64/32
7A0000h–7AFFFFh
3D0000h–3D7FFFh
SA123
1111011xxx
64/32
7B0000h–7BFFFFh
3D8000h–3DFFFFh
SA124
1111100xxx
64/32
7C0000h–7CFFFFh
3E0000h–3E7FFFh
SA125
1111101xxx
64/32
7D0000h–7DFFFFh
3E8000h–3EFFFFh
SA126
1111110xxx
64/32
7E0000h–7EFFFFh
3F0000h–3F7FFFh
SA127
1111111000
8/4
7F0000h–7F1FFFh
3F8000h–3F8FFFh
SA128
1111111001
8/4
7F2000h–7F3FFFh
3F9000h–3F9FFFh
SA129
1111111010
8/4
7F4000h–7F5FFFh
3FA000h–3FAFFFh
SA130
1111111011
8/4
7F6000h–7F7FFFh
3FB000h–3FBFFFh
SA131
1111111100
8/4
7F8000h–7F9FFFh
3FC000h–3FCFFFh
SA132
1111111101
8/4
7FA000h–7FBFFFh
3FD000h–3FDFFFh
SA133
1111111110
8/4
7FC000h–7FDFFFh
3FE000h–3FEFFFh
SA134
1111111111
8/4
7FE000h–7FFFFFh
3FF000h–3FFFFFh
Table 12. S29GL064M (Model R3) Top Boot Sector Architecture (Continued)
Sector
Sector Address
A21–A12
Sector Size
(Kbytes/Kwords)
(x8)
Address Range
(x16)
Address Range
相关PDF资料
PDF描述
S29GL032M10BFIR23 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 220uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 9.0mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
S29GL032M10BFIR12 MirrorBit Flash Family
S29GL032M10BFIR13 MirrorBit Flash Family
S29GL032M10BFIR30 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 220uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 12mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
S29GL032M10FAIR22 MirrorBit Flash Family
相关代理商/技术参数
参数描述
S29GL032M10BFIR23 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family
S29GL032M10BFIR30 制造商:SPANSION 制造商全称:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
S29GL032M10BFIR32 制造商:SPANSION 制造商全称:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
S29GL032M10BFIR33 制造商:SPANSION 制造商全称:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
S29GL032M10BFIR40 制造商:SPANSION 制造商全称:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology