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参数资料
型号： S29GL032M10BFIR22
厂商： SPANSION LLC
元件分类： PROM
英文描述： T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 220uF; Working Voltage (Vdc)[max]: 4V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 12mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
中文描述： 2M X 16 FLASH 3V PROM, 100 ns, PBGA64
封装： 13 X 11 MM, LEAD FREE, FORTIFIED BGA-64
文件页数： 74/158页
文件大小： 4695K
代理商： S29GL032M10BFIR22
22
S29GLxxxM MirrorBitTM Flash Family
S29GLxxxM_00_B1_E August 4, 2004
Data she e t
Table 1. S29GL032M Ordering Options
Notes:
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types
0, 2, or 3.
2. This package is recommended for new designs using TSOPs.
3. TSOP package marking omits packing type designator from the ordering part number.
4. BGA package marking omits leading “S29” and packing type designator from the ordering part number.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales
office to confirm availability of specific valid combinations and to check on newly released combinations.
S29GL032M Valid Combinations
Package Description
Device
Number
Speed
Option
Package, Material, &
Temperature Range
Model
Number
Packing
Type
S29GL032M
90
TAC,TFC
R0
0,2,3
(note 1)
TS040 (note 2, 3)
TSOP
BAC,BFC
FBC048 (note 4)
Fine-Pitch BGA
TAC,TFC
R1,R2
TS056 (note 2, 3)
TSOP
BAC,BFC
LAA064 (note 4)
Fortified BGA
TAC,TFC
R3,R4
TS048 (note 2, 3)
TSOP
BAC,BFC
FBC048 ((note 4)
Fine-Pitch BGA
FAC,FFC
LAA064 (note 4)
Fortified BGA
10, 11
TAI,TFI
R0
TS040 (note 2, 3)
TSOP
BAI,BFI
FBC048 (note 4)
Fine-Pitch BGA
TAI,TFI
R1,R2
TS056 (note 2, 3)
TSOP
BAI,BFI
LAA064 (note 4)
Fortified BGA
TAI,TFI
R3,R4
TS048 (note 2, 3)
TSOP
BAI,BFI
FBC048 (note 4)
Fine-Pitch BGA
FAI,FFI
LAA064 (note 4)
Fortified BGA
TBI,TCI
FPT-48P-M19 (note 3)
TSOP
BAI,BFI
R5,R6
BGA-48P-M20 (note 4)
Fine-Pitch BGA
相关PDF资料
PDF描述
S29GL032M10BFIR23 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 220uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 9.0mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
S29GL032M10BFIR12 MirrorBit Flash Family
S29GL032M10BFIR13 MirrorBit Flash Family
S29GL032M10BFIR30 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 220uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 12mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
S29GL032M10FAIR22 MirrorBit Flash Family
相关代理商/技术参数
参数描述
S29GL032M10BFIR23 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family
S29GL032M10BFIR30 制造商:SPANSION 制造商全称:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
S29GL032M10BFIR32 制造商:SPANSION 制造商全称:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
S29GL032M10BFIR33 制造商:SPANSION 制造商全称:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
S29GL032M10BFIR40 制造商:SPANSION 制造商全称:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
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