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参数资料
| 型号： | S71PL064J08BAW9Z2 |
| 厂商： | Spansion Inc. |
| 英文描述： | Based MCPs |
| 中文描述： | 基于MCP的 |
| 文件页数： | 19/24页 |
| 文件大小： | 296K |
| 代理商： | S71PL064J08BAW9Z2 |
March 17, 2006S71PL-J_00_B3
S71PL-J Based MCPs
17
A d v a n c e I n f o r m a t i o n
TSB064—64-ball Fine-Pitch Ball Grid Array (FBGA) 8 x 11.6 mm Package
3351 \ 16-038.22a
PACKAGE
TSB 064
JEDEC
N/A
D x E
11.60 mm x 8.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.20
PROFILE
A1
017
---
---
BALL HEIGHT
A2
0.81
---
0.97
BODY THICKNESS
D
11.60 BSC.
BODY SIZE
E
8.00 BSC.
BODY SIZE
D1
8.80 BSC.
MATRIX FOOTPRINT
E1
7.20 BSC.
MATRIX FOOTPRINT
MD
12
MATRIX SIZE D DIRECTION
ME
10
MATRIX SIZE E DIRECTION
n
φ
b
eE
64
BALL COUNT
0.35
0.40
0.45
BALL DIAMETER
0.80 BSC.
BALL PITCH
eD
0.80 BSC
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
A2,A3,A4,A5,A6,A7,A8,A9
B1,B2,B3,B4,B7,B8,B9,B10
C1,C2,C9,C10,D1,D10,E1,E10
F1,F5,F6,F10,G1,G5,G6,G10
H1,H10,J1,J10,K1,K2,K9,K10
ML1,L2,L3,L4,L7,L8,L9,L10
DEPOPULATED SOLDER BALLS
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9.
N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
C
C
0.08
A1
b
64X
0.15 M C A B
0.08 M C
6
SIDE VIEW
7
SE
E1
CORNER
PIN A1
A
C
D
B
D1
A
10
eD
9
8
6
5
3
eE
2
4
7
E
D
0.15
C
(2X)
G
F
E
K
J
H
SD
7
M
L
1
C
C
0.15
B
(2X)
0.20
10
PIN A1
CORNER
INDEX MARK
A2
A
TOP VIEW
BOTTOM VIEW
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| S71PL064J08BAW9Z3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Based MCPs |
| S71PL064J08BAWTZ0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Based MCPs |
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| S71PL064J08BAWTZ3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Based MCPs |
| S71PL064J08BFW0B2 | 制造商:Spansion 功能描述:COMBO 4MX16 FLASH + 512KX16 SRAM 3V 56FBGA - Tape and Reel |
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