- 您现在的位置：买卖IC网 > PDF目录297344 > S71WS256NC0BFWAP0 (SPANSION LLC) Stacked Multi-Chip Product (MCP) PDF资料下载
参数资料
| 型号： | S71WS256NC0BFWAP0 |
| 厂商： | SPANSION LLC |
| 元件分类： | 存储器 |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA84 |
| 封装： | 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84 |
| 文件页数： | 13/13页 |
| 文件大小： | 332K |
| 代理商： | S71WS256NC0BFWAP0 |
July 19, 2006 S71WS-N_00_A6
S71WS-N
7
Da ta
Sh e e t
(Adv a n ce
In f o r m ation)
5.2.2
Look-Ahead Pinout for Future Designs
Please refer to the Design-in Scalable Wireless Solutions with Spansion Products application note
(publication number: Design_Scalable_Wireless_A0_E). Contact your local Spansion sales representative for
more details.
5.3
Physical Dimensions
5.3.1
TLA084—84-ball Fine-Pitch Ball Grid Array (FBGA) 11.6 x 8.0 x 1.2 mm
3372-2 \ 16-038.22a
PACKAGE
TLA 084
JEDEC
N/A
D x E
11.60 mm x 8.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
1.20
PROFILE
A1
0.17
---
BALL HEIGHT
A2
0.81
---
0.97
BODY THICKNESS
D
11.60 BSC.
BODY SIZE
E
8.00 BSC.
BODY SIZE
D1
8.80 BSC.
MATRIX FOOTPRINT
E1
7.20 BSC.
MATRIX FOOTPRINT
MD
12
MATRIX SIZE D DIRECTION
ME
10
MATRIX SIZE E DIRECTION
n
84
BALL COUNT
b
0.35
0.40
0.45
BALL DIAMETER
eE
0.80 BSC.
BALL PITCH
eD
0.80 BSC
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
A2,A3,A4,A5,A6,A7,A8,A9
DEPOPULATED SOLDER BALLS
B1,B10,C1,C10,D1,D10,
E1,E10,F1,F10,G1,G10,
H1,H10,J1,J10,K1,K10,L1,L10,
M2,M3,M4,M5,M6,M7,M8,M9
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9.
N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
C
0.08
0.20 C
A
E
B
C
0.15
(2X)
C
D
C
0.15
(2X)
INDEX MARK
10
6
b
TOP VIEW
SIDE VIEW
CORNER
84X
A1
A2
A
0.15
C A B
M
C
M
0.08
PIN A1
ML
E1
7
SE
A
D1
eD
DC
E
F
G
H
J
K
10
8
9
7
6
4
3
2
1
eE
5
B
PIN A1
CORNER
7
SD
BOTTOM VIEW
相关PDF资料 |
PDF描述 |
|---|---|
| S71WS256NC0BFWAP2 | Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BFWAP3 | Stacked Multi-Chip Product (MCP) |
| S71WS256ND0BFWYJ0 | Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BAWTJ2 | Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BAWTJ3 | Stacked Multi-Chip Product (MCP) |
相关代理商/技术参数 |
参数描述 |
|---|---|
| S71WS256NC0BFWAP2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BFWAP3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BFWE20 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BFWE22 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BFWE23 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
发布紧急采购，3分钟左右您将得到回复。