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参数资料
| 型号： | S71WS256NC0BFWAP0 |
| 厂商： | SPANSION LLC |
| 元件分类： | 存储器 |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA84 |
| 封装： | 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84 |
| 文件页数： | 5/13页 |
| 文件大小： | 332K |
| 代理商： | S71WS256NC0BFWAP0 |
July 19, 2006 S71WS-N_00_A6
S71WS-N
11
Da ta
Sh e e t
(Adv a n ce
In f o r m ation)
6.
Revision History
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,
the prior authorization by the respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any
damages of any kind arising out of the use of the information in this document.
Copyright 2004-2006 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations
thereof are trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.
Section
Description
Revision A (February 1, 2004)
Initial release.
Revision A1 (February 9, 2005)
Global
Updated document to include Burst Speed of 66 MHz
Updated Publication Number
Revision A2 (March 31, 2005)
Global
Updated Product Selector Guide and Ordering Information tables
Revision A3 (May 2, 2005)
Global
Added 80 MHz speed options to:
Product Selector Guide
Ordering Information table
Valid Combination table
Revision A4 (August 25, 2005)
Global
Replaced module cellRAM_00_A0 with cellRAM_03 and cellRAM_04
Revision A5 (February 7, 2006)
Global
Updated Product Selector Guide with new options
Updated the Ordering Part Number table
Updated the Valid Combinations table
Removed the Look-ahead Diagram
Revision A6 (July 19, 2006)
Global
Reformatted document to new template
Added reference to 32 Mb CellRAM module
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| S71WS256NC0BFWAP2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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