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参数资料
| 型号： | S71WS256PD0HFFLW2 |
| 厂商： | Spansion Inc. |
| 英文描述： | based MCP/POP Products |
| 中文描述： | 基于MCP的/持久性有机污染物产品 |
| 文件页数： | 14/15页 |
| 文件大小： | 357K |
| 代理商： | S71WS256PD0HFFLW2 |
12
S75WS-P based MCP/POP Products
S75WS-P_00_02 September 6, 2006
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
7.2
FMC115 — 115-ball 12 x 9 mm MCP
PACKAGE
FMC 115
JEDEC
N/A
D x E
12.00 mm x 9.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.40
PROFILE
A1
0.17
---
---
BALL HEIGHT
A2
0.96
---
1.11
BODY THICKNESS
D
12.00 BSC.
BODY SIZE
E
9.00 BSC.
BODY SIZE
D1
10.4 BSC.
MATRIX FOOTPRINT
E1
7.20 BSC.
MATRIX FOOTPRINT
MD
14
MATRIX SIZE D DIRECTION
ME
10
MATRIX SIZE E DIRECTION
n
115
BALL COUNT
b
0.35
0.40
0.45
BALL DIAMETER
eE
0.80 BSC.
BALL PITCH
eD
0.80 BSC
BALL PITCH
SD SE
0.40 BSC.
SOLDER BALL PLACEMENT
A3,A4,A5,A6,A7,A8
B3,B4,B5,B6,B7,B8,C1
N3,N4,N5,N6,N7,N8
P3,P4,P5,P6,P7,P8
DEPOPULATED SOLDER BALLS
3603 \ 16-038.19 \ 9.6.6
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JEP95, SECTION
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E"
DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL
POSITIONS FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO
DATUMS A AND B AND DEFINE THE POSITION OF THE
CENTER SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS
IN THE OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS
IN THE OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
9.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER
OR INK MARK, METALLIZED MARK INDENTATION OR
OTHER MEANS.
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| S71WS256PD0HFFLW3 | based MCP/POP Products |
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| S71WS256PD0JFFLW2 | based MCP/POP Products |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| S71WS256PD0HFFLW3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:based MCP/POP Products |
| S71WS256PD0HH3SR0 | 制造商:Spansion 功能描述:IC MCP 256/128P - Trays 制造商:Spansion 功能描述:IC MCP 256/128p |
| S71WS256PD0JF3HL0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Memory with CellularRAM |
| S71WS256PD0JF3HL2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Memory with CellularRAM |
| S71WS256PD0JF3HL3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash Memory with CellularRAM |
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