- 您现在的位置：买卖IC网 > PDF目录1967 > SC16C750BIB64,151 (NXP Semiconductors)IC UART SINGLE W/FIFO 64-LQFP PDF资料下载
参数资料
| 型号： | SC16C750BIB64,151 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 33/44页 |
| 文件大小： | 0K |
| 描述： | IC UART SINGLE W/FIFO 64-LQFP |
| 产品培训模块： | Stand-Alone UARTs |
| 标准包装： | 160 |
| 通道数： | 1，UART |
| FIFO's： | 64 字节 |
| 电源电压： | 2.5V，3.3V，5V |
| 带自动流量控制功能： | 是 |
| 带故障启动位检测功能： | 是 |
| 带调制解调器控制功能： | 是 |
| 带CMOS： | 是 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 64-LQFP |
| 供应商设备封装： | 64-LQFP（10x10） |
| 包装： | 托盘 |
| 产品目录页面： | 828 (CN2011-ZH PDF) |
| 其它名称： | 568-3284 935274403151 SC16C750BIB64-S |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页当前第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页
SC16C750B_5
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 17 October 2008
39 of 44
NXP Semiconductors
SC16C750B
5 V, 3.3 V and 2.5 V UART with 64-byte FIFOs
12. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reow
soldering description”.
12.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for ne pitch SMDs. Reow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
12.2 Wave and reow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature prole. Leaded packages,
packages with solder balls, and leadless packages are all reow solderable.
Key characteristics in both wave and reow soldering are:
Board specications, including the board nish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
12.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
相关PDF资料 |
PDF描述 |
|---|---|
| SC16C752BIBS,157 | IC DUAL UART 64BYTE 32HVQFN |
| SC16C752IB48,128 | IC DUAL UART 64BYTE 48LQFP |
| SC16C754BIB80,557 | IC UART QUAD W/FIFO 80-LQFP |
| SC16C850IBS/Q900,5 | IC UART SGL UNIV ASYNC 36-VFQFN |
| SC16C852VIET,151 | IC UART DUAL W/FIFO 36TFBGA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SC16C750BIB64-F | 功能描述:UART 接口集成电路 16CB 2.5V-5V 1CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16C750BIB64-S | 功能描述:UART 接口集成电路 16CB 2.5V-5V 1CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16C750BIBS | 功能描述:UART 接口集成电路 16CB 2.5V-5V 1CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16C750BIBS,128 | 功能描述:UART 接口集成电路 16CB 2.5V-5V 1CH RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16C750BIBS,151 | 功能描述:UART 接口集成电路 1CH. UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
发布紧急采购，3分钟左右您将得到回复。