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参数资料
| 型号： | SC16IS752IPW-T |
| 厂商： | NXP Semiconductors |
| 文件页数： | 51/60页 |
| 文件大小： | 0K |
| 描述： | IC UART DUAL I2C/SPI 28-TSSOP |
| 标准包装： | 2,500 |
| 特点： | 低电流 |
| 通道数： | 2，DUART |
| FIFO's： | 64 字节 |
| 规程： | RS232，RS485 |
| 电源电压： | 2.5V, 3.3V |
| 带自动流量控制功能： | 是 |
| 带IrDA 编码器/解码器： | 是 |
| 带故障启动位检测功能： | 是 |
| 带调制解调器控制功能： | 是 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 28-TSSOP |
| 包装： | 带卷 (TR) |
| 配用： | 568-4000-ND - DEMO BOARD SPI/I2C TO DUAL UART 568-3510-ND - DEMO BOARD SPI/I2C TO UART |
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SC16IS752_SC16IS762
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 9 — 22 March 2012
55 of 60
NXP Semiconductors
SC16IS752; SC16IS762
Dual UART with I2C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 39) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 40 and 41
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 39.
Table 40.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
Table 41.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SC16IS760 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Single UART with I2C-bus/SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support |
| SC16IS760IBS | 功能描述:UART 接口集成电路 I2C/SPI-UARTBRIDGE W/IRDA AND GPIO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16IS760IBS,128 | 功能描述:UART 接口集成电路 I2C/SPI-UARTBRIDGE RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16IS760IBS,151 | 功能描述:UART 接口集成电路 UART I2C/SPI RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC16IS760IBS,157 | 功能描述:UART 接口集成电路 I2C/SPI-UARTBRIDGE RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
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