参数资料
型号: SC403MLTRT
厂商: Semtech
文件页数: 28/32页
文件大小: 741K
描述: IC REG DL BCK/LINEAR SYNC 32MLPQ
标准包装: 1
系列: EcoSpeed®, SmartDrive™
拓扑: 降压(降压)同步(1),线性(LDO)(1)
功能: 任何功能
输出数: 2
频率 - 开关: 1MHz
电压/电流 - 输出 1: 可调至 0.75V,6A
电压/电流 - 输出 2: 可调至 0.75V,200mA
带 LED 驱动器:
带监控器:
带序列发生器:
电源电压: 3 V ~ 28 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 32-VFQFN 裸露焊盘
供应商设备封装: 32-MLPQ(5x5)
包装: 标准包装
其它名称: SC403MLDKR
SC403
28
Applications Information (continued)
All other decoupling capacitors must be located
as close as possible to the IC.
PGND Plane
PGND requires its own copper plane with no
other signal traces routed on it.
Copper planes, multiple vias and wide traces are
needed to connect PGND to input capacitors,
output capacitors, and the PGND pins on the
device.
The PGND copper area between the input
capacitors, output capacitors, and PGND pins
must be as tight and compact as possible to
reduce the area of the PCB that is exposed to
noise due to current flow on this node.
Connect PGND to AGND with a short trace or
0& resistor. This connection should be as close
to the device as possible.
"
"
"
"
"
VOUT Plane
on Top layer
L
CLDO
C
IN
CFF
RFB2
RFB1
RILIM
RLDO2
RLDO1
LX plane on inner
or bottom layer
All components
shown Top Side
AGND plane on
inner layer
V
IN
 plane on inner
or bottom layer
RGND  AGND connects to
PGND close to the IC
Pin 1 marking
IC with vias for
LX, AGND, VIN
C
OUT
PGND on inner
or bottom layer
PGND
PGND on
Top Layer
V5V Decoupling Capacitor
RGND
Figure 15  PCB Layout
PCB Layout Guidelines
The optimum layout for the SC403 is shown in Figure 15.
This layout shows an integrated FET buck regulator with a
maximum current of 6A. The total PCB area is approxi-
mately 20 x 25 mm.
Critical Layout Guidelines
The following critical layout guidelines must be followed
to ensure proper performance of the device.
IC decoupling capacitors
PGND plane
AGND island
FB, VOUT, and other analog control signals
BST, ILIM, and LX
CIN and COUT placement and current loops
IC Decoupling Capacitors
A 0.1 糉 capacitor must be located as close as
possible to the IC and directly connected to pins
3 (VDD) and 4 (AGND).
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