参数资料
型号: SC667ULTRT
厂商: Semtech
文件页数: 24/47页
文件大小: 0K
描述: IC LED DRVR LMU 7CH MLPQUT20
特色产品: Semtech sc667 and sc668
标准包装: 1
拓扑: 线性(LDO),PWM
输出数: 11
内部驱动器:
类型 - 主要: 背光,LED 闪烁器,照明管理装置(LMU)
频率: 400kHz
电源电压: 2.9 V ~ 5.5 V
安装类型: 表面贴装
封装/外壳: 20-UFQFN 裸露焊盘
供应商设备封装: 20-MLPQ(3x3)
包装: 标准包装
工作温度: -40°C ~ 85°C
其它名称: SC667ULDKR
SC667
Applications Information (continued)
PCB Layout Considerations
The layout diagram in Figure 17 illustrates a two-layer
PCB layout for the SC667 and supporting components.
Following fundamental layout rules is
critical for achieving the performance specified in the
Electrical Characteristics table. The following guidelines
are recommended when developing a PCB layout:
?
Place all bypass and decoupling capacitors —
C IN , C LDO1 , C LDO2 , C LDO3 , C LDO4 , and C BYP as close to
the device as possible.
?
Ensure that all connections to pins IN and OUT
make use of wide traces so that the resistive
drop on each connection is minimized.
?
The thermal pad should be connected to the
ground plane using multiple vias to ensure
proper thermal connection for optimal heat
transfer.
?
C LDO1 , C LDO2 , C LDO3 , C LDO4 , and C BYP should be
grounded together. Connect these capacitors to
?
?
Figure 18 shows the component copper layer.
Make all ground connections to a solid ground
plane as shown in Figure 19.
All LDO output traces should be made as wide
as possible to minimize resistive losses.
the ground plane at one point near the SC667 as
shown in Figure 17.
Figure 18 — Layer 1
Ground
Plane
CLDO2
CLDO3
CLDO4
CBYP
CLDO1
VIN
GND
CIN
LDO1
VIN
GND
PWM
BL7
GND
SC667
IRQ
SDA
SCL
ADI
BL1
Figure 17 — Recommended PCB Layout
Figure 19 — Layer 2
24
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