参数资料
| 型号： | SC70EV |
| 厂商： | Microchip Technology |
| 文件页数： | 15/42页 |
| 文件大小： | 0K |
| 描述： | BOARD DEMO MCP40X POTENTIOMETER |
| 标准包装： | 1 |
| 主要目的： | 裸评估板 |
| 嵌入式： | 否 |
| 主要属性： | SC70-6/5/3、SOT-23-8/6/5/3 和 DIP-8 评估板 |
| 次要属性： | 用于 PICmicro? MCU、ADC、DAC 和其它设备 |
| 已供物品： | 5 裸板，CD |
| 产品目录页面： | 659 (CN2011-ZH PDF) |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页当前第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页
Installation and Operation
TABLE 2-1:
OPTIONAL PASSIVE COMPONENTS (2)
Component
C1, C2
R1U, R2U, R3U, R4U, R5U, R6U, R7U, R8U
R1D, R2D, R3D, R4D, R5D, R6D, R7D, R8D
Comment
Power supply bypass capacitors
Pull-up resistor
Pull-down resistor (1)
Note 1:
2:
Whichever pin is the device’s VDD pin, that corresponding RXD footprint can be
used for the device’s bypass capacitor. So if Pin 8 is the device’s VDD pin, then
install the bypass capacitor in the R8D footprint.
All passive components use the surface mount 805 footprint
2.4
SC70-6 AND SOT-23-6/8 TO DIP-8 EVALUATION BOARD DESCRIPTION
The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board PCB is designed to be flexible
in the type of device evaluation that can be implemented.
The following sections describe each element of this evaluation board in further detail.
2.4.1
Power and Ground
The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board has a VDD Pad and a VSS
pad. These pads can have connection posts installed that allows easy connection to
the power (V DD ) and ground (V SS ) planes. The layout allows either through-hole or
surface-mount connectors.
The power and ground planes are connected to the appropriate passive components
on the PCB (such as power plane to RXU and ground plane to RXD components).
2.4.2
PCB PADs
For each package pin (pins 1 to 8), there is a PCB pad (pads 1 to 8). The device will
have some power pins (V DD ) and some ground pins (V SS ). To ease connections on the
PCB, vias to the power and ground plane have been installed close to each PCB pad.
This allows any pad to be connected to the power or ground plane (see Figure 2-3). So
when power is connected to the VDD and VSS pads, the power is connected to the
appropriate device pin.
Jumpering to VSS
or
Jumpering to VDD
or
0 Ω
0 Ω
FIGURE 2-3:
? 2009 Microchip Technology Inc.
Connecting the PCB pad to either VDD or VSS.
DS51874A-page 15
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