参数资料
型号: SC70EV
厂商: Microchip Technology
文件页数: 17/42页
文件大小: 0K
描述: BOARD DEMO MCP40X POTENTIOMETER
标准包装: 1
主要目的: 裸评估板
嵌入式:
主要属性: SC70-6/5/3、SOT-23-8/6/5/3 和 DIP-8 评估板
次要属性: 用于 PICmicro? MCU、ADC、DAC 和其它设备
已供物品: 5 裸板,CD
产品目录页面: 659 (CN2011-ZH PDF)
Installation and Operation
2.4.4.2
SOT-23-6
The 6-pin SOT-23 footprint is laid out for packages that have a typical pitch of 0.65 mm
(BSC), a maximum lead width of 0.45 mm, and a maximum molded package width of
1.75 mm. Six lead SOT-23 packages that meet these characteristics should be able to
be used with this board.
2.4.4.3
DIP-8
The 8-pin DIP footprint is laid out for packages that have a typical pitch of 100 mil
(BSC), a maximum lead width of 22 mil, and a molded package width of 300 mil. 8-lead
SOT-23 packages that meet these characteristics should be able to be used with this
board.
2.4.4.4
PASSIVE COMPONENTS
All passive components (RXU, RXD, and CX) use a surface mount 805 footprint. Any
component that has a compatible footprint could be used with this board.
2.4.4.5
HEADER (1X6)
The header has a typical pitch of 100 mil (BSC). This header is designed to be
compatible with the PICkit Serial Analyzer and PICkit 2 Programmer.
? 2009 Microchip Technology Inc.
DS51874A-page 17
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