参数资料
型号: SC811ULTRT
厂商: Semtech
文件页数: 10/23页
文件大小: 0K
描述: IC BATTERY MANAGEMENT
标准包装: 1
系列: *
其它名称: SC811ULDKR
SC811 / SC813
Pin Descriptions
Pin #
1
2
3
4
5
6
7
8
T
Pin Name
VIN
MODE
STATB
GND
IPUSB
IPRGM
BAT
ENB
Thermal Pad
Pin Function
Supply pin — connect to charging adapter (wall adapter or USB). This pin is protected against damage due to
high voltage up to 30V.
Charging mode selection (tri-level logical) input — Logical high selects USB high power mode, floating selects
USB low power mode, ground selects adapter mode.
Status output pin — This open-drain pin is asserted (pulled low) when a valid charging supply is connected to
the VIN pin, and a charging cycle begins. It is released when the termination current is reached, indicating that
charging is complete. STATB is not asserted for re-charge cycles.
Ground
Fast-charge and pre-charge current programming pin for a USB mode charging source — USB high power mode
(100%) and low power mode (20%) fast-charge current are programmed by connecting a resistor from this pin to
ground. USB low power mode pre-charge current is equal to the low power mode fast-charge current (20% of USB
high power mode fast-charge current).
Adapter mode fast-charge, adapter and USB high power modes pre-charge, and all modes termination current
programming pin — Connect a resistor from this pin to ground. Pre-charge current is 20% of IPRGM-programmed
adapter mode fast-charge current when in adapter mode or USB high power mode. The charging termination
current threshold (for adapter or either USB mode selection) is 10% of the IPRGM programmed fast-charge current.
Charger output — connect to battery positive terminal.
Combined device enable/disable — Logic high disables the device. Tie to GND to enable charging with indefinite
float-charging. Float this pin to enable charging without float-charge upon termination. Note that this pin must
be grounded if the SC811/3 is to be operated without a battery connected to BAT.
Pad is for heatsinking purposes — not connected internally. Connect exposed pad to ground plane using
multiple vias.
10
? 2008 Semtech Corporation
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