参数资料
型号: SED1522DOB
元件分类: 显示控制器
英文描述: DOT MAT LCD DRVR AND DSPL CTLR, UUC100
封装: 4.80 X 7.04 MM, 0.525 MM HEIGHT, GOLD BUMP, DIE-100
文件页数: 10/10页
文件大小: 40K
代理商: SED1522DOB
351
s PAD LAYOUT
° Aluminum pad chip specifications
Chip dimensions:
4.80
× 7.04 × 0.40mm
Pad surface area:
100
× 100m
° Gold bump chip specifications (reference only)
Minimum bump pitch:
199
m
Bump height:
20
m
Bump size:
132
× 111 m (±20 m)
Chip dimensions:
4.80
× 7.04 × 0.525mm
100
1
5
10
15
20
25
30
95
90
85
80
75
70
65
60
55
35
40
45
50
D1520D
AA
*
Y
X
4.80mm
7.04mm
+10
–5
* The die shown is the SED1522DAA. The final A in the suffix
indicates that the device is an aluminum pad product.
Bump chip products share the same die part number as
aluminum products; however, the last letter of the suffix is
B.
SED1522
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