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参数资料
| 型号： | SEP8WL2001 |
| 元件分类： | LED |
| 英文描述： | SINGLE COLOR LED, WHITE, 13.3 mm |
| 封装： | 13.70 X 5.23 MM, LEAD FREE, SURFACE MOUNT PACKAGE-16 |
| 文件页数： | 2/12页 |
| 文件大小： | 861K |
| 代理商： | SEP8WL2001 |
Multi Chip White LED Modules
SEPW Series
10
WARNING
— These devices are designed to be operated at lethal voltages and energy levels. Circuit designs
that embody these components must conform with applicable safety requirements. Precautions must be
taken to prevent accidental contact with power-line potentials. Do not connect grounded test equipment.
The use of an isolation transformer is recommended during circuit development and breadboarding.
This product series emits high light output. Do NOT look directly into the light emitting area. Direct
exposure to the light over an extended time period may harm eyes.
Because reliability can be affected adversely by improper storage
environments and handling methods, please observe the following:
Cautions for Storage
Ensure that storage conditions are within 5°C to 40°C and relative
humidity < 30%; avoid storage locations that experience extreme
changes in temperature or humidity.
Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
Reinspect for rust on leads and solderability of products that have
been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other
standard test periods, protect the products from power surges
from the testing device, shorts between adjacent products, and
shorts to the heatsink.
Precautions During Use
Because the light generated inside the LED must be emitted
efficiently out of the module, a resin with high light transmittance
is used. Therefore, additives that are commonly used in
semiconductor devices to improve the heat resistance or moisture
resistance (such as silica glass) cannot be added to the resin.
Consequently, the ability of the resin to withstand heat is usually
low and the following precautions must be observed.
Never apply an external force, stress, or excess vibration to resin
or terminals when at high temperature.
Take particular care about heat dissipation when designing the
application. If dissipation is not adequate, the LEDs can reach
high temperatures, with resulting color change, luminous flux
reduction, and shortening of product lifetime.
When the device is connected to an external radiator, please
coat the heatsink area with thermal conduction material such as
thermal conductive bond or thermal conductive grease.
Extra attention should be paid to the sealing resin of the product,
which is rubber-like silicon resin. The surface of sealing resin is
slightly sticky (surface tack). Therefore, touching the emitting area
or exposing it to unclean conditions may cause dust or smudges
to adhere to it and possibly penetrate the resin. This could
cause deterioration of product characteristics when contacted by
materials such as epoxy resin.
The silver plating of the leadframe may discolor if the product
comes into contact with material containing sulfides or if it is
exposed to an atmosphere containing sulfide gas.
The emitting area of the LEDs contains fine gold wires. Touching
this area without care may add excess stress on the internal gold
wires and may result in disconnection of the internal wires.
Soldering
The product is in a surface mount package. The product should
not be mounted on warped direction of the PCB.
When the product is mounted by means of solder reflow and the
resin is unusually damp, solder dipping may cause interfacial
defoliation. This occurs when a drastic temperature change
causes moisture in the resin to evaporate and to swell. Therefore,
attention must be paid to the following:
Examine the moisture-resistant packing before opening. If
the indicator color (blue) of the desiccant (such as silica gel)
has disappeared, the product must be prebaked as described
below.
After the product packing is opened and staged for assembly,
soldering should be carried out as soon as practicable.
During handling, ambient conditions should be 5°C to 30°C,
with relative humidity < 70%
After 120 hours of exposure, prebake is recommended
before soldering; bake-out at 60±5°C for more than 10 hours
After soldering, no mechanical force or excessive vibration should
be applied to the product until the product has cooled down to
normal room temperature. Quick cooling must be avoided.
When soldering the products, please be sure to minimize the
working time, within the following limits:
Soldering Iron Temperature
(°C)
Time
(s)
350±10
3 (once only)
Reflow soldering can be performed a maximum of 2 times, with
preheat conditions of 150°C to 180°C (at the device surface)
for 60 to 120 s, and soldering conditions less than 40 s at more
than 220°C, with a peak temperature less than 260°C, using the
following recommended profile:
Reflow Soldering Profile
20
60
100
140
180
220
260
300
Soldering Time (s)
Temperature
of
Device
Package
Surface
(°C)
Pre-heat
60 to 120 sec
Max
40 sec
Peak 260°C Max
0
50
100
150
200
250
300
Between the first and second reflow sessions, follow the
guidelines in the Cautions for Storage section, above.
Electrostatic Discharge
When handling the products, operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SEP8WN2001 | 制造商:Allegro MicroSystems LLC 功能描述:LED MODULE NATURAL-WHITE 制造商:ALLEGRO 功能描述:LED Light Bar,Blue,SO 制造商:Allegro MicroSystems LLC 功能描述:LED Light Bar,Blue,SO |
| SE-P-900 | 制造商:IDEC CORPORATION 功能描述:95ACC1840 Protective stand |
| SEP-90160-01 | 制造商:Samtec Inc 功能描述:WIRE HOOK-UP SOLID CONDUCTOR - Bulk |
| SEP-96 | 制造商:VERO 功能描述:VEROBOARD 100X160MM 制造商:Vero Technologies 功能描述:VEROBOARD 100X160MM |
| SEPA7HSF-50370 | 制造商:SUPERWORLD 制造商全称:Superworld Electronics 功能描述:HIGH FREQUENCY TRANSFORMER |
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