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参数资料
| 型号： | SFC05-5.TC |
| 元件分类： | TVS二极管 - 瞬态电压抑制 |
| 英文描述： | 200 W, UNIDIRECTIONAL, 5 ELEMENT, SILICON, TVS DIODE, MO-211BB |
| 封装： | FLIP CHIP, CSP-6 |
| 文件页数： | 4/7页 |
| 文件大小： | 619K |
| 代理商： | SFC05-5.TC |
4
2003 Semtech Corp.
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
SFC05-5
Device Connection Options
The SFC05-5 has solder bumps located in a 3 x 2
matrix layout on the active side of the device. The
bumps are designated by the numbers 1 - 3 along the
horizontal axis and letters A - B along the vertical axis.
The lines to be protected are connected at bumps A1,
B1, A2, A3, and B3. Bump B2 is connected to ground.
All path lengths should be kept as short as possible to
minimize the effects of parasitic inductance in the
board traces.
Wafer Level CSP TVS
CSP TVS devices are wafer level chip scale packages.
They eliminate external plastic packages and leads and
thus result in a significant board space savings. Manu-
facturing costs are minimized since they do not require
an intermediate level interconnect or interposer layer
for reliable operation. They are compatible with cur-
rent pick and place equipment further reducing manu-
facturing costs. Certain precautions and design
considerations have to be observed however for
maximum solder joint reliability. These include solder
pad definition, board finish, and assembly parameters.
Printed Circuit Board Mounting
Non-solder mask defined (NSMD) land patterns are
recommended for mounting the SFC05-5. Solder
mask defined (SMD) pads produce stress points near
the solder mask on the PCB side that can result in
solder joint cracking when exposed to extreme fatigue
conditions. The recommended pad size is 0.225 ±
0.010 mm with a solder mask opening of 0.350 ±
0.025 mm.
Grid Courtyard
The recommended grid placement courtyard is 1.3 x
1.8 mm. The grid courtyard is intended to encompass
the land pattern and the component body that is
centered in the land pattern. When placing parts on a
PCB, the highest recommended density is when one
courtyard touches another.
Applications Information
Device Schematic and Pin Configuration
Layout Example
NSMD Package Footprint
To Protected IC
To Connector
Ground
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SFC05C-1.TC | 制造商:Semtech Corporation 功能描述: 制造商:Semtech Corporation 功能描述:350 W, BIDIRECTIONAL, SILICON, TVS DIODE |
| SFC-1 | 功能描述:I/O 连接器 SFP CAGE 1 PORT RoHS:否 制造商:Hirose Connector 产品:Plugs 系列:DH 端口数量: 位置/触点数量:51 节距:1 mm 触点电镀: 触点材料: 型式:Male 电流额定值:0.5 A 安装风格:Cable 端接类型:IDC 颜色: 安装角: |
| SFC10 | 制造商:Omron Corporation 功能描述: |
| SFC-10 | 制造商:Marcom Electronic Components 功能描述:FERRITE CORE SPLIT 10.5MM 266OHM 制造商:Marcom Electronic Components 功能描述:FERRITE CORE HINGED 10.5MM 制造商:Marcom Electronic Components 功能描述:FERRITE CORE, SPLIT, 10.5MM, 266OHM/100MHZ; Cable Diameter Max:10.5mm; Ferrite Mounting:Split Core; Frequency Range:-; Impedance:266ohm; Series:SFC ;RoHS Compliant: Yes |
| SFC1015 | 制造商:SUMIDA 制造商全称:Sumida Corporation 功能描述:EMC CHOKE COIL |
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