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参数资料
| 型号： | SG3626R |
| 厂商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分类： | MOSFETs |
| 英文描述： | DUAL HIGH SPEED DRIVER |
| 中文描述： | 3 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, MBFM5 |
| 封装： | METAL CAN, TO-66, 5 PIN |
| 文件页数： | 2/8页 |
| 文件大小： | 148K |
| 代理商： | SG3626R |
9/91 Rev 1.1 2/94
Copyright
1994
L
IN
F
IN
ITY
Microelectronics Inc.
11861 Western Avenue
∞
∞
Garden Grove, CA 92841
(714) 898-8121
∞
FAX: (714) 893-2570
2
SG1626/SG2626/SG3626
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Supply Voltage (V
) ...........................................................
Logic Input Voltage ...............................................................
Source/Sink Output Current (Each Output)
Continuous ...................................................................
Pulse, 500ns ................................................................
22V
7V
±
0.5A
±
3.0A
Operating Junction Temperature
Hermetic (J, T, Y, R-Packages) ...................................
Plastic (M, DW, L-Packages) .......................................
Storage Temperature Range ............................
Lead Temperature (Soldering, 10 Seconds) ...................
150
°
C
150
°
C
-65
°
C to 150
°
C
300
°
C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect to ground. All currents are positive into the
specified terminal.
THERMAL DATA
J Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 30°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
.............. 80°C/W
Y Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 50°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............ 130°C/W
M Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 60°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............. 95°C/W
DW Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 40°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
.............. 95°C/W
T Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 25°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
........... 130°C/W
R Package:
Thermal Resistance-
Junction to Case
,
θ
JC
................. 5.0°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............. 40°C/W
L Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 35°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
........... 120°C/W
Note A.
Note B. The above numbers for
θ
are maximums for the limiting
thermal resistance of the package in a standard mount-
ing configuration. The
θ
numbers are meant to be
guidelines for the thermal performance of the device/pc-
board system. All of the above assume no ambient
airflow.
Junction Temperature Calculation: T
= T
+ (P
x
θ
).
V
IN
= 2.4V
V
IN
= 5.5V
V
IN
= 0V
I
IN
= -10mA
I
OUT
= -200mA
I
OUT
= 200mA
V
IN
= 2.4V (both inputs)
V
IN
= 0V (both inputs)
Logic 1 Input Voltage
Logic 0 Input Voltage
Input High Current
Input High Current
Input Low Current
Input Clamp Voltage
Output High Voltage
(Note 4)
Output Low Voltage
(Note 4)
Supply Current Outputs Low
Supply Current Outputs High
0.7
500
1.0
-4
-1.5
1.0
27
12
V
V
μ
A
mA
mA
V
V
V
mA
mA
2.0
V
CC
-3
18
7.5
-55
°
C to 125
°
C
-25
°
C to 85
°
C
0
°
C to 70
°
C
Note 2. Range over which the device is functional.
Note 3. AC performance has been optimized for V
CC
= 8V to 20V.
Supply Voltage (V
) ..................................
Frequency Range ...............................................
Peak Pulse Current ............................................................
Logic Input Voltage ................................................
4.5V to 20V
(Note 3)
DC to 1.5MHz
±
3A
-0.5 to 5.5V
Operating Ambient Temperature Range (T
)
SG1626 .........................................................
SG2626 ...........................................................
SG3626 ..............................................................
RECOMMENDED OPERATING CONDITIONS
(Note 2)
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specfiications apply over the operating ambient temperatures for SG1626 with -55
°
C
≤
T
≤
125
°
C, SG2626 with -
25
°
C
≤
T
≤
85
°
C, SG3626 with 0
°
C
≤
T
≤
70
°
C, and V
CC
= 20V. Low duty cycle pulse testing techniques are used which maintains junction and case
temperatures equal to the ambient temperature.)
Test Conditions
Parameter
Static Characteristics
Units
SG1626/2626/3626
Min.
Typ. Max.
Note 4. V
CC
= 10V to 20V.
相关PDF资料 |
PDF描述 |
|---|---|
| SG3626T | DUAL HIGH SPEED DRIVER |
| SG3626Y | DUAL HIGH SPEED DRIVER |
| SG2626 | DUAL HIGH SPEED DRIVER |
| SG2626M | DUAL HIGH SPEED DRIVER |
| SG2626R | DUAL HIGH SPEED DRIVER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SG3626T | 制造商:Microsemi Corporation 功能描述:SG3626T - Bulk |
| SG3626Y | 制造商:Microsemi Corporation 功能描述:MOSFET DRVR 3A 2-OUT HI/LO SIDE INV 8CDIP - Bulk |
| SG3629 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:HIGH CURRENT FLOATING SWITCH DRIVER |
| SG3629R | 制造商:未知厂家 制造商全称:未知厂家 功能描述:HIGH CURRENT FLOATING SWITCH DRIVER |
| SG3629T | 制造商:未知厂家 制造商全称:未知厂家 功能描述:HIGH CURRENT FLOATING SWITCH DRIVER |
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