参数资料
型号: SG5841SZ
厂商: Fairchild Semiconductor
文件页数: 14/15页
文件大小: 0K
描述: IC PWM FLYBACK ISOLATED CM 8-SOP
产品变化通告: Mold Compound Change 12/Dec/2007
标准包装: 2,500
输出隔离: 隔离
频率范围: 62kHz ~ 68kHz
输入电压: 11 V ~ 24.7 V
输出电压: 18V
工作温度: -20°C ~ 85°C
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: *
包装: 带卷 (TR)
Physical Dimensions (Continued)
9.83
9.00
6.67
6.096
8.255
7.61
5.08 MAX
0.33 MIN
3.683
3.20
7.62
(0.56)
2.54
0.56
0.355
3.60
3.00
1.65
1.27
0.356
0.20
9.957
7.87
7.62
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO
JEDEC MS-001 VARIATION BA
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH, AND TIE BAR EXTRUSIONS.
D) DIMENSIONS AND TOLERANCES PER
ASME Y14.5M-1994
E) DRAWING FILENAME AND REVSION: MKT-N08FREV2.
Figure 17.
8-Pin Dual Inline Package (DIP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/ .
? 2006 Fairchild Semiconductor Corporation
SG5841J ? Rev. 1.3.5
14
www.fairchildsemi.com
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