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参数资料
| 型号： | SI-SX72-ACQ256SFG484 |
| 厂商： | Microsemi SoC |
| 文件页数： | 22/35页 |
| 文件大小： | 0K |
| 描述： | ADAPTER BOARD 256CQFP-484FBGA |
| 标准包装： | 1 |
| 系列： | * |
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Gull wing Surface mount Foot Soldering Instructions (continued)
reflow oven. The Ironwood gull wing foot has a larger thermal mass than an actual QFP package, and therefore,
may require longer reflow time and/or higher temperature
settings.
(f) Inspect solder fillets. Add additional solder paste to
solder deficient areas as needed or remove excess with
small tip solder iron and copper desoldering braid (Figure
4). If the solder has not completely reflowed, add solder
flux and repeat step (e).
Because of the construction of the emulator foot, a Low
Temperature solder paste must be used. Set reflow
equipment to the lowest setting that will reflow the solder
paste. Reflow the emulator foot with target assembly in a
temperature range of 185 - 210 degree C . This can be
varied depending upon the profile of the oven and the
Figure 4: Removing excess solder
customer assemblies. The above temperature range is safe
for soldering the emulator foot without thermal damage to
the foot. It is recommended that reflow oven be set for a minimum time initially. If reflow was not complete,
reflux and reflow for a longer duration.
250
Maximum Package Body Temperature
200
Solder Temperature Melting Point
1° to 3°C
150
per Second
150 - 180 Seconds
<2°C
per Second
100
50
<2°C
per Second
Preheat
Flux Activation
Reflow
Cool-Down
0
100
200
300
400
500
Time (seconds)
Figure 5: Recommended Convection Oven Reflow Profile
HOT AIR TOOL - Soldering method #2
Repeat steps (a) through (d) in method #1. The surface tension present between the solder and the emulator
foot in method #1 will not be present in method #2, due to the fact that only a small portion of the solder in this
method will be liquid at one time. It is necessary therefore, to align the foot over the land pattern with greater
accuracy.
Page 2 of 4
reflow instruction, Rev. C
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