参数资料
型号: SI4737-C40-GM
厂商: Silicon Laboratories Inc
文件页数: 37/42页
文件大小: 0K
描述: IC RX AM/FM/WB RDS/RBDS 20UQFN
标准包装: 490
频率: 520kHz ~ 1.71MHz,64MHz ~ 108MHz,162.4MHz ~ 162.55MHz
调制或协议: AM,FM,WB
应用: 通用
电流 - 接收: 19.9mA
数据接口: PCB,表面贴装
天线连接器: PCB,表面贴装
特点: 配有 RSSI
电源电压: 2.7 V ~ 5.5 V
工作温度: -20°C ~ 85°C
封装/外壳: 20-UFQFN 裸露焊盘
供应商设备封装: 20-QFN(3x3)
包装: 托盘
Si4736/37/38/39-C40
Table 18. PCB Land Pattern Dimensions
Symbol
Millimeters
Symbol
Millimeters
Min
Max
Min
Max
D
2.71 REF
GE
2.10
D2
1.60
1.80
W
0.34
e
E
0.50 BSC
2.71 REF
X
Y
0.28
0.61 REF
E2
1.60
1.80
ZE
3.31
f
GD
2.53 BSC
2.10
ZD
3.31
Notes: General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
Notes: Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 μm minimum, all the way around the pad.
Notes: Stencil Design
1. A stainless steel, laser-cut, and electro-polished stencil with trapezoidal walls should
be used to assure good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
4. A 1.45 x 1.45 mm square aperture should be used for the center pad. This provides
approximately 70% solder paste coverage on the pad, which is optimum to assure
correct component stand-off.
Notes: Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification
for Small Body Components.
Rev. 1.0
37
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